IP Library Granted Patent US 8,598,781
Granted Patent B2
US 8,598,781 · App. 12/315,000 · Granted Dec 3, 2013

Organic light emitting display (OLED) and its method of fabrication

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Quick Facts
Patent No.
US 8,598,781
App. No.
12/315,000
Granted
Dec 3, 2013
Kind
B2
Abstract

An Organic Light Emitting Display (OLED) and a method of fabricating the OLED includes: a substrate including a pixel region and a non-pixel region; a gate electrode arranged in the non-pixel region of the substrate; a first insulating layer arranged on the substrate having the gate electrode formed thereon, and having an open groove on an upper surface of a region opposite to the gate electrode; a semiconductor layer buried in the groove and including a source region, a channel region and a drain region; and an organic thin film layer arranged in the pixel region of the substrate. A common electrode is arranged between the drain region of the semiconductor layer and the organic thin film layer to electrically couple the drain region to the organic thin film layer.

Claims (27)

1. An Organic Light Emitting Display (OLED) comprising:

a substrate including a pixel region and a non-pixel region;

a gate electrode arranged in the non-pixel region of the substrate;

a first insulating layer arranged on the substrate where the gate electrode is formed, and having an open groove on an upper surface of a region opposite to the gate electrode, said insulating layer in direct contact with the gate electrode and substrate;

a semiconductor layer buried in the groove and including a source region, a channel region, and a drain region; and

an organic thin film layer arranged in the pixel region of the substrate; and

a common electrode arranged between the drain region of the semiconductor layer and the organic thin film layer to electrically couple the drain region to the organic thin film layer, and the common electrode directly making contact with the drain region of the semiconductor layer.

2. The OLED as claimed in claim 1 , wherein the common electrode is electrically coupled to the drain region of the semiconductor layer and extends to the pixel region of the substrate.

3. The OLED as claimed in claim 1 , wherein the semiconductor layer comprises zinc oxide (ZnO).

4. The OLED as claimed in claim 3 , wherein the semiconductor layer is doped with at least one of indium (In), gallium (Ga) or stannum (Sn).

5. The OLED as claimed in claim 1 , wherein the first insulating layer is at least one material selected from the group consisting of polyimide, polyacryl, photoresist, and benzocyclobutene (BCB).

6. A method of fabricating an Organic Light Emitting Display (OLED), the method comprising:

dividing a substrate into a pixel region and a non-pixel region;

forming a gate electrode in the non-pixel region of the substrate;

forming a first insulating layer on an entire surface of the substrate where the gate electrode is formed, said insulating layer in direct contact with the gate electrode and substrate;

patterning the first insulating layer to form a groove in a region opposite to the gate electrode;

forming a semiconductor layer buried in the groove and including a source region, a channel region and a drain region;

forming a source electrode in contact with the source region of the semiconductor layer;

forming a common electrode directly making contact with the drain region of the semiconductor layer and extending to the pixel region of the substrate; and

forming an organic thin film layer on the common electrode.

7. The method as claimed in claim 6 , wherein the semiconductor layer is formed by any one of lift-off, inkjet and etching methods.

8. The method as claimed in claim 7 , wherein the lift-off method of forming the semiconductor layer comprises:

coating a photoresist on an entire surface of the first insulating layer where the groove is formed;

removing the photoresist coated on the groove;

coating a semiconductor material on the groove and the photoresist; and

removing the photoresist.

9. The method as claimed in claim 7 , wherein the inkjet method of forming the semiconductor layer is performed by disposing a semiconductor material in the groove.

Assignments (2)
DIVESTITURE Recorded Sep 21, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029070/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2009
From: LEE, HUN-JUNG; JEONG, JAE-KYEONG; MO, STEVE Y.G.
To: SAMSUNG MOBILE DISPLAY CO., LTD., A CORPORATION CHARTERED IN AND EXISTING UNDER THE LAWS OF THE REPUBLIC OF KOREA
Reel/Frame 022459/0016 →