Fluid cooled encapsulated microelectronic package
View Patent ↗An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
1. A microelectronic package, comprising:
a first semiconductor chip mounted to a substrate;
a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
a thermally conductive bonding material disposed between said cooling tube and the first surface of said first semiconductor chip, thermally bonding said cooling tube to said first surface;
at least one fluid coupling secured to an open end of said tube and adapted for receiving a mating fluid source or drain conduit, said coupling defining an outer surface portion secured to said substrate; and
a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube and substrate in proximity to said semiconductor chip,
wherein said plastic encapsulant is molded over portions of said fluid coupling.
2. The microelectronic package of claim 1 , wherein said cooling tube is copper and said thermally conductive bonding material is indium solder.