IP Library Granted Patent US 8,102,224
Granted Patent B2
US 8,102,224 · App. 12/320,347 · Granted Jan 24, 2012

Micromechanical resonator

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Quick Facts
Patent No.
US 8,102,224
App. No.
12/320,347
Granted
Jan 24, 2012
Kind
B2
Abstract

The invention relates to design of micromechanical resonators and, more precisely, to the design of microelectromechanical systems (MEMS) resonators. The invention provides an improved design structure for a microelectromechanical systems (MEMS) resonator in which the width of the spring elements ( 3 ), ( 23 - 24 ), ( 27 - 30 ) is greater than the width of the electrode fingers ( 5 - 9 ), ( 25 - 26 ), ( 31 - 34 ), said widths specifically dimensioned so that the sensitivity of the resonant frequency change with respect to dimensional manufacturing variations d(Δω 0 /ω 0 )/dδ approaches zero. The improved structure is frequency robust to manufacturing variations and enables reliable frequency referencing with good performance, particularly in small size solutions.

Claims (37)

1. A micromechanical resonator, comprising:

a movable mass structure comprising at least two electrode fingers that are connected together; and

a spring structure comprising at least one spring element anchored from one end and connected to the mass on the other end, wherein a width of the spring elements is greater than the width of the electrode fingers, said widths specifically dimensioned so that a sensitivity of a resonant frequency change with respect to dimensional manufacturing variations d(Δω 0 /ω 0 )/dδ approaches zero, wherein Δω 0 is the frequency change of the resonant frequency ω 0 as function of a dimension change δ, wherein said spring structure consists of two spring elements that are anchored together to form a tuning fork structure.

2. A micromechanical resonator according to claim 1 , wherein the micromechanical resonator has the width of the spring elements 2 to 5 times the width of the electrode fingers.

3. A micromechanical resonator according to claim 1 , wherein the micromechanical resonator has the width of the spring elements approximately 3 times the width of the electrode fingers.

4. A micromechanical resonator according to claim 1 , wherein the micromechanical resonator additionally has means for actuating the resonator electrostatically.

5. A micromechanical resonator according to claim 1 , wherein the micromechanical resonator has a width of an electrode gap from 500 nm to 5 μm.

6. A micromechanical resonator, comprising:

a movable mass structure comprising at least two electrode fingers that are connected together; and

a spring structure comprising at least one spring element anchored from one end and connected to the mass on the other end, wherein a width of the spring elements is greater than the width of the electrode fingers, said widths specifically dimensioned so that a sensitivity of a resonant frequency change with respect to dimensional manufacturing variations d(Δω 0 /ω 0 )/dδ approaches zero, wherein Δω 0 is the frequency change of the resonant frequency ω 0 as function of a dimension change δ, wherein the resonant frequencies of said electrode fingers are 2 to 5 times higher than the resonant frequency for the resonator.

7. A micromechanical resonator, comprising:

a movable mass structure comprising at least two electrode fingers that are connected together, and

a spring structure comprising at least one spring element anchored from one end and connected to the mass on the other end, wherein a width of the spring elements is greater than the width of the electrode fingers, said widths specifically dimensioned so that a sensitivity of a resonant frequency change with respect to dimensional manufacturing variations d(Δω 0 /ω 0 )/dδ approaches zero, wherein Δω 0 is the frequency change of the resonant frequency ω 0 as function of a dimension change δ, wherein said widths are dimensioned so that the slope of the resonant frequency change with respect to dimensional manufacturing variation change approaches zero at two or more locations.

8. A micromechanical resonator, comprising:

a movable mass structure comprising at least two electrode fingers that are connected together; and

a spring structure comprising at least one spring element anchored from one end and connected to the mass on the other end, wherein a width of the spring elements is greater than the width of the electrode fingers, said widths specifically dimensioned so that a sensitivity of a resonant frequency change with respect to dimensional manufacturing variations d(Δω 0 /ω 0 )/dδ approaches zero, wherein Δω 0 is the frequency change of the resonant frequency ω 0 as function of a dimension change δ, wherein in dimensioning said widths, the effect of bending of the electrode fingers is taken into account.

9. A micromechanical resonator, comprising:

a movable mass structure comprising at least two electrode fingers that are connected together; and

a spring structure comprising at least one spring element anchored from one end and connected to the mass on the other end, wherein a width of the spring elements is greater than the width of the electrode fingers, said widths specifically dimensioned so that a sensitivity of a resonant frequency change with respect to dimensional manufacturing variations d(Δω 0 /ω 0 )/dδ approaches zero, wherein Δω 0 is the frequency change of the resonant frequency ω 0 as function of a dimension change δ, wherein the length of the electrode fingers is also dimensioned so that electrode finger resonant frequency affects the resonator resonant frequency so that a localized maximum of the resonator resonant frequency change with respect to dimensional manufacturing variation change is generated.

10. A micromechanical resonator according to claim 9 , wherein the micromechanical resonator has the length of the electrode fingers ⅙ to ½ times the length of the spring elements.

11. A micromechanical resonator, comprising:

a movable mass structure comprising at least two electrode fingers that are connected together; and

a spring structure comprising at least one spring element anchored from one end and connected to the mass on the other end, wherein a width of the spring elements is greater than the width of the electrode fingers, said widths specifically dimensioned so that a sensitivity of a resonant frequency change with respect to dimensional manufacturing variations d(Δω 0 /ω 0 )/dδ approaches zero, wherein Δω 0 is the frequency change of the resonant frequency ω 0 as function of a dimension change δ, wherein in dimensioning said widths, the resonance frequency

ω

f

=

0.8

Y

ρ

w

f

L

f

2

of the electrode fingers is taken into account, wherein Y is Young's modulus, ρ is density, w f is a width of the at least one spring element, and L f is an electrode finger length.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2021
From: MURATA ELECTRONICS OY
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 057705/0891 →
CHANGE OF NAME Recorded Oct 22, 2012
From: VTI TECHNOLOGIES OY
To: MURATA ELECTRONICS OY
Reel/Frame 029170/0012 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2009
From: KAAJAKARI, VILLE
To: VTI TECHNOLOGIES OY
Reel/Frame 022490/0105 →