Cell device and cell string for high density NAND flash memory
The invention relates a cell device and a cell string for high density flash memory. The cell string includes a plurality of cell devices and switching devices connected to ends of the plurality of cell devices. The cell device includes a semiconductor substrate, an insulating film, a charge storage node composed of nano-sized dots, a control insulating film and a control electrode which are sequentially formed on the semiconductor substrate, without source/drain regions. In the cell string, the silicon substrate enables easy formation of an inversion layer acting as the source/drain regions. The switching device does not include a source or drain region at a side connected to an adjacent cell device but includes a source or drain region at the side opposite to the side connected to the adjacent cell device. The invention improves miniaturizability and performance of cell devices for NAND flash memory, and induces an inversion layer by using a fringing electric field generated from the control electrode and the charge storage node, thus allowing for electrical connection between cells or between cell strings.
1 . A cell string for flash memory which includes a plurality of cell devices sequentially connected to each other and one or more switching devices disposed at ends of the plurality of cell devices to allow for selection of the cell string, in which each of the plurality of cell devices comprises:
a semiconductor substrate;
a first semiconductor thin film disposed on the semiconductor substrate;
a second semiconductor thin film disposed on the first semiconductor thin film;
a permeable insulating film disposed on the second semiconductor thin film;
a charge storage node, a control insulating film and a control electrode which are sequentially disposed on the permeable insulating film; and
a buried insulating film disposed in the first semiconductor thin film,
wherein each of the plurality of cell devices does not include source/drain regions,
the first semiconductor thin film is made of semiconductor material different from that of the semiconductor substrate while the second semiconductor thin film is made of the same semiconductor material as that of the semiconductor substrate, and
the charge storage node is composed of dots including nano-sized fine particles.
2 . The cell string for flash memory according to claim 1 , wherein the buried insulating film is disposed in the first semiconductor thin film between adjacent cell devices, or is disposed in the first semiconductor thin film under all of the plurality of cell devices of the cell string.
3 . The cell string for flash memory according to claim 1 , wherein each of the switching devices does not include a source or drain region at a side connected to an adjacent cell device but each does include a source or drain region at a side opposite to the side connected to the adjacent cell device, in which the source or drain region is positioned so as not to overlap the control electrode.
4 . The cell string for flash memory according to claim 1 , wherein each of the switching devices does not include a source or drain region at a side connected to an adjacent cell device but does include a source or drain region at a side opposite to the side connected to the adjacent cell device, in which the source or drain region is positioned so as to overlap the control electrode.
5 . The cell string for flash memory according to claim 1 , wherein the control electrodes of the cell devices and the switching devices are provided on lateral surfaces thereof with insulating spacers, and an insulating film is provided between the insulating spacers.
6 . A cell string for flash memory which includes a plurality of cell devices sequentially connected to each other and one or more switching devices disposed at ends of the plurality of cell devices to allow for selection of the cell string, in which each of the plurality of cell devices comprises:
a semiconductor substrate;
a permeable insulating film disposed on the semiconductor substrate;
a charge storage node, a control insulating film and a control electrode which are sequentially disposed on the permeable insulating film; and
a buried insulating film disposed in the semiconductor substrate,
wherein the charge storage node is composed of dots including nano-sized fine particles and the cell devices do not include source and drain regions.
7 . The cell string for flash memory according to claim 6 , wherein the buried insulating film is disposed in the semiconductor substrate between adjacent cell devices, or is disposed in the semiconductor substrate under all of the plurality of cell devices of the cell string.
8 . A cell string for flash memory which includes a plurality of cell devices sequentially connected to each other and one or more switching devices disposed at ends of the plurality of cell devices to allow for selection of the cell string, in which each of the plurality of cell devices comprises:
a semiconductor substrate;
a first semiconductor thin film disposed on the semiconductor substrate;
a second semiconductor thin film disposed on the first semiconductor thin film;
a permeable insulating film disposed on the second semiconductor thin film;
a charge storage node, a control insulating film and a control electrode which are sequentially disposed on the permeable insulating film;
source and drain regions disposed on a surface of the second semiconductor thin film; and
a buried insulating film disposed in the first semiconductor thin film between adjacent cell devices and under the source and drain regions,
wherein the first semiconductor thin film is made of semiconductor material different from that of the semiconductor substrate while the second semiconductor thin film is made of the same semiconductor material as that of the semiconductor substrate,
the charge storage node is composed of dots including nano-sized fine particles, and
the source and drain regions are configured so as not to overlap the control electrode.
9 . The cell string for flash memory according to claim 8 , wherein source and drain regions of the switching devices are configured so as not to overlap the control electrode of the switching devices.
10 . The cell string for flash memory according to claim 8 , wherein a source or drain region of each of the switching devices, which is disposed at a side connected to an adjacent cell device, is configured so as not to overlap the control electrode of the switching device while a source or drain region of the switching device, which is disposed at a side opposite to the side connected to the adjacent cell device, is configured so as to overlap the control electrode of the switching device.
11 . The cell string for flash memory according to claim 8 , wherein source and drain regions of the switching devices are doped at a higher concentration than that of the source and drain regions of the cell devices.
12 . A cell string for flash memory which includes a plurality of cell devices sequentially connected to each other and one or more switching devices disposed at ends of the plurality of cell devices to allow for selection of the cell string, in which each of the plurality of cell devices comprises:
a semiconductor substrate;
a permeable insulating film disposed on the semiconductor substrate;
a charge storage node and a control insulating film which are sequentially disposed on the permeable insulating film;
a control electrode disposed on the control insulating film;
source and drain regions disposed on a surface of the semiconductor substrate; and
a buried insulating film disposed in the semiconductor substrate between adjacent cell devices and under the source and drain regions,
wherein the charge storage node is composed of dots including nano-sized fine particles, and
the source and drain regions are configured so as not to overlap the control electrode.
13 . The cell string for flash memory according to claim 12 , wherein source and drain regions of the switching devices are configured so as not to overlap the control electrode of the switching devices.
14 . The cell string for flash memory according to claim 12 , wherein a source or drain region of each of the switching devices, which is disposed at a side connected to an adjacent cell device, is configured so as not to overlap the control electrode of the switching device while a source or drain region of the switching device, which is disposed at a side opposite to the side connected to the adjacent cell device, is configured so as to overlap the control electrode of the switching device.
15 . The cell string for flash memory according to claim 12 , wherein source and drain regions of the switching devices are doped at a higher concentration than that of the source and drain regions of the cell devices.