Microphone package
View Patent ↗In one exemplary embodiment, an apparatus includes: a first substrate having an aperture adapted to receive an acoustic signal; a microphone comprising a plate connected to the first substrate and a movable member connected to the first substrate, where the microphone is adapted to transduce the received acoustic signal into an electrical signal; a second substrate connected to the first substrate; at least one wall connected to the first substrate and the second substrate such that the at least one wall, the first substrate, the second substrate and the microphone define an interior cavity; and an electrical component on the second substrate and electrically coupled to the microphone, where the electrical component is configured to generate an output based on the electrical signal.
1. An apparatus comprising:
a first substrate comprising an aperture adapted to receive an acoustic signal;
a microphone comprising a plate connected to the first substrate and a movable member connected to the first substrate, where the microphone is adapted to transduce the received acoustic signal into an electrical signal;
a second substrate connected to the first substrate;
at least one wall connected to the first substrate and the second substrate such that the at least one wall, the first substrate, the second substrate and the microphone define an interior cavity;
an electrical component on the second substrate and electrically coupled to the microphone, where the electrical component is configured to generate an output based on the electrical signal; and
at least one internal contact connected to the first substrate and the second substrate, where the at least one internal contact is configured to electrically couple the electrical component to the microphone.
2. An apparatus as in claim 1 , where the movable member comprises a diaphragm or a membrane.
3. An apparatus as in claim 1 , where the first substrate comprises a printed circuit board.
4. An apparatus as in claim 1 , where the second substrate comprises a printed circuit board.
5. An apparatus as in claim 1 , further comprising a case connected to the first substrate and the second substrate.
6. An apparatus as in claim 5 , where the case comprises a metal case.
7. An apparatus as in claim 1 , where the electrical component comprises an integrated circuit component.
8. An apparatus as in claim 1 , where the microphone comprises a microelectromechanical system microphone.
9. An apparatus as in claim 1 , where the apparatus comprises a microelectromechanical system microphone module.
10. An apparatus as in claim 1 , where the apparatus comprises a microelectromechanical system microphone module embodied within a mobile device.
11. An apparatus as in claim 1 , where the apparatus comprises a top port microelectromechanical system microphone module embodied within a mobile phone.