Solid-state imaging device and method for manufacturing thereof as well as driving method of solid-state imaging device
View Patent ↗A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.
1. A method of manufacturing a solid-state imaging device comprising the steps of:
providing on one side of a light-receiving sensor portion constituting a pixel an electrode for reading a signal charge from said light-receiving sensor portion,
forming a light-shielding film covering an image pickup area except said light-receiving sensor portion, to which a predetermined voltage signal is applied; and
forming a second-conductivity-type semiconductor area in the center on the surface of a first-conductivity-type semiconductor area constituting a photoelectric conversion area of said light-receiving sensor portion,
wherein,
after said first-conductivity-type semiconductor area is formed, said second-conductivity-type semiconductor area is formed in the center on the surface of said first-conductivity-type semiconductor area, and an area containing a lower impurity concentration than that of said second-conductivity-type semiconductor area is formed at the end on the side of said electrode and at the opposite end on the side of a pixel-separation area, on the surface of said first-conductivity-type semiconductor area, and
when forming said second-conductivity-type semiconductor area and said area containing a lower impurity concentration than that of said second-conductivity-type semiconductor area, the ion implantation toward the end on the side of said electrode is performed separately from the ion implantation toward the opposite end on the side of the pixel-separation area.
2. A method of manufacturing a solid-state imaging device comprising the steps of:
providing on one side of a light-receiving sensor portion constituting a pixel an electrode for reading a signal charge from said light-receiving sensor portion,
forming a light-shielding film covering an image pickup area except said light-receiving sensor portion, to which a predetermined voltage signal is applied; and
forming a second-conductivity-type semiconductor area in the center on the surface of a first-conductivity-type semiconductor area constituting a photoelectric conversion area of said light-receiving sensor portion,
wherein,
after said first-conductivity-type semiconductor area is formed, said second-conductivity-type semiconductor area is formed in the center on the surface of said first-conductivity-type semiconductor area, and an area containing a lower impurity concentration than that of said second-conductivity-type semiconductor area is formed at the end on the side of said electrode and at the opposite end on the side of a pixel-separation area, on the surface of said first-conductivity-type semiconductor area, and
after said first-conductivity-type semiconductor area is formed, said light-shielding film is formed, an opening is formed in said light-shielding film above said light-receiving sensor portion, and the ion implantation is performed using said light-shielding film as a mask to form said second-conductivity-type semiconductor area.