IP Library Granted Patent US 8,045,297
Granted Patent B2
US 8,045,297 · App. 12/323,329 · Granted Oct 25, 2011

Flex cable and method for lowering flex cable impedance

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Quick Facts
Patent No.
US 8,045,297
App. No.
12/323,329
Granted
Oct 25, 2011
Kind
B2
Abstract

A flex cable comprises a base film, a first adhesive layer coupled with the base film, and at least two signal traces coupled with the first adhesive layer. The flex cable comprises a second adhesive layer coupled with the signal traces and the first adhesive layer, and a cover film coupled with the second adhesive layer. The flex cable comprises an electrically conductive layer adjacent to the signal traces, and parallel with the base film and the cover film.

Claims (46)

1. A flex cable comprising:

a base film;

a first adhesive layer coupled with said base film;

at least two signal traces coupled with said first adhesive layer;

a second adhesive layer coupled with said signal traces and said first adhesive layer;

a cover film coupled with said second adhesive layer; and

an electrically conductive layer adjacent to said signal traces, and parallel with said base film and said cover film.

2. The flex cable of claim 1 wherein said electrically conductive layer is approximately 3 microns or greater in thickness.

3. The flex cable of claim 1 wherein said electrically conductive layer is selected from the group of metals and metal alloys consisting of: copper, aluminum, silver, and gold.

4. The flex cable of claim 1 wherein said electrically conductive layer is coupled with said base film.

5. The flex cable of claim 1 wherein said electrically conductive layer is coupled with said first adhesive.

6. The flex cable of claim 1 wherein said electrically conductive layer is coupled with said second adhesive.

7. The flex cable of claim 1 wherein said electrically conductive layer is coupled with said cover film.

8. The flex cable of claim 1 wherein said base film and said cover film are selected from the group of polymers consisting of: polyimide, UPILEX, KAPTON, polyester, and MYLAR.

9. The flex cable of claim 1 wherein said signal trace comprises copper.

10. A hard disk drive comprising:

a flex cable communicatively coupling an actuator assembly to a printed circuit board, said flex cable having:

a base film;

a first adhesive layer coupled with said base film;

at least two signal traces coupled with said first adhesive layer;

a second adhesive layer coupled with said signal traces and said first adhesive layer;

a cover film coupled with said second adhesive layer; and

an electrically conductive layer adjacent to said signal traces, and parallel with said base film and said cover film.

11. The hard disk drive of claim 10 wherein said electrically conductive layer is approximately 3 microns or greater in thickness.

12. The hard disk drive of claim 10 wherein said electrically conductive layer is selected from the group of metals and metal alloys consisting of: copper, aluminum, silver, and gold.

13. The hard disk drive of claim 10 wherein said electrically conductive layer is coupled with said base film.

14. The hard disk drive of claim 10 wherein said electrically conductive layer is coupled with said first adhesive.

15. The hard disk drive of claim 10 wherein said electrically conductive layer is coupled with said second adhesive.

16. The hard disk drive of claim 10 wherein said electrically conductive layer is coupled with said cover film.

17. The hard disk drive of claim 10 wherein said base film and said cover film are selected from the group of polymers consisting of: polyimide, UPILEX, KAPTON, polyester, and MYLAR.

18. The hard disk drive of claim 10 wherein said signal trace comprises copper.

19. A method of lowering the impedance of a flex cable, said method comprising:

applying a first adhesive to a base film;

laminating a conductive foil to said base film with said first adhesive;

etching from said conductive foil at least two signal traces;

applying a second adhesive to a cover film;

laminating said cover layer with said second adhesive layer to said signal traces and said first adhesive layer; and

coupling an electrically conductive layer adjacent to said signal traces, and parallel with said base film and said cover film, thereby capacitively coupling said signal traces with said electrically conductive layer hence lowering the impedance of said flex cable.

20. The method as recited in claim 19 wherein said coupling said electrically conductive layer comprises:

depositing an electrically conductive layer onto said base film.

21. The method as recited in claim 19 wherein said coupling said electrically conductive layer comprises:

depositing an electrically conductive layer onto said cover film.

22. The method as recited in claim 19 wherein said coupling said electrically conductive layer comprises:

adhesively coupling an electrically conductive layer with said cover film.

23. The method as recited in claim 19 wherein said coupling said electrically conductive layer comprises:

coupling an electrically conductive layer of a thickness and width such that impedance of said signal traces is lowered to approximately 50 ohms or less.

Assignments (7)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0821 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2009
From: CONTRERAS, JOHN; FRANCA-NETO, LUIZ; SHEN, JR-YI
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V
Reel/Frame 022069/0526 →