Semiconductor device

1. A semiconductor device comprising:

a first MISFET fabricated over a semiconductor substrate and having a first conductive type; and

a second MISFET fabricated over the semiconductor substrate and having the same conductive type as the first conductive type,

wherein the first MISFET includes:

(a1) a first gate insulating film arranged over the semiconductor substrate;

(b1) a first gate electrode arranged over the first gate insulating film; and

(c1) a first source region and a first drain region,

wherein the second MISFET includes:

(a2) a second gate insulating film arranged over the semiconductor substrate;

(b2) a second gate electrode arranged over the second gate insulating film; and

(c2) a second source region and a second drain region,

wherein the first gate electrode and the second gate electrode are coupled electrically, the first source region and the second source region are coupled electrically, and the first drain region and the second drain region are coupled electrically, accordingly the first MISFET and the second MISFET are coupled in parallel,

wherein a threshold voltage of the first MISFET and a threshold voltage of the second MISFET are different from each other,

wherein the first source region and the first drain region are formed in a first active region,

wherein the second source region and the second drain region are formed in a second active region, and

wherein the first active region and the second active region are separated from each other by an element isolation region,

wherein the first source region formed in the first active region and the second source region formed in the second active region are coupled by wiring, and the first drain region formed in the first active region and the second drain region formed in the second active region are coupled by wiring, and

wherein when the first MISFET is in an OFF state, the second MISFET is in the OFF state, and when the first MISFET is in an ON state, the second MISFET is in the ON state.

2. The semiconductor device according to claim 1 ,

wherein a first leakage current of the first MISFET is lower than a second leakage current of the second MISFET,

wherein the first leakage current is a current between the first source region and the first drain region of the first MISFET in the OFF state, and

wherein the second leakage current is a current between the second source region and the second drain region of the second MISFET in the OFF state.

3. The semiconductor device according to claim 2 ,

wherein the semiconductor device includes a logic circuit and a memory cell array having a plurality of memory cells, and

wherein the first MISFET and the second MISFET are located at the logic circuit.

4. The semiconductor device according to claim 3 ,

wherein the first MISFET and the second MISFET are both p-channel type MISFETs.

5. The semiconductor device according to claim 3 ,

wherein the first MISFET and the second MISFET are both n-channel type MISFETs.

6. The semiconductor device according to claim 4 ,

wherein the semiconductor device includes an inverter circuit having the first MISFET and the second MISFET.

7. The semiconductor device according to claim 5 ,

wherein the semiconductor device includes an inverter circuit having the first MISFET and the second MISFET.

8. The semiconductor device according to claim 4 ,

wherein the semiconductor device includes a NAND circuit having the first MISFET and the second MISFET.

9. The semiconductor device according to claim 5 ,

wherein the semiconductor device includes a NAND circuit having the first MISFET and the second MISFET.

10. The semiconductor device according to claim 4 ,

wherein the semiconductor device includes a NOR circuit having the first MISFET and the second MISFET.

11. The semiconductor device according to claim 5 ,

wherein the semiconductor device includes a NOR circuit having the first MISFET and the second MISFET.