Simulated patina for copper
View Patent ↗A process for imparting a simulated patina appearance to a copper substrate including selecting a colorant having the desired initial patina color tone and producing a noncontinuous layer of the colorant on a surface of the copper substrate to provide the appearance of patination of the desired tone via interspersed spots of the colorant. The remaining portion of the substrate is exposed for natural patination.
1. A process for imparting a simulated patina appearance to a copper substrate comprising the steps of:
selecting a paint having a desired initial patina color tone; and
applying said paint to a copper substrate surface to produce a noncontinuous layer of said paint of the desired initial patina color tone on a surface of the copper substrate, said noncontinuous layer of paint providing the appearance of patination of the desired tone via interspersed spots of said paint, and providing an exposed portion of the surface of the copper substrate for natural patination.
2. The process of claim 1 wherein the step of applying comprises the step of spattering said paint on said copper substrate surface.
3. The process of claim 2 wherein said spattering step is performed to produce non-uniform spattering of said paint on said copper substrate surface.
4. The process of claim 3 wherein said applying step further comprises the step of mechanically removing paint from said copper substrate surface using a wire brush.
5. The process of claim 4 wherein said mechanically removing step is performed to produce a non-uniform distribution of paint spots on said copper substrate surface.
6. The process of claim 1 wherein said step of applying comprises painting a paint on said copper substrate surface.
7. The process of claim 1 wherein said step of applying comprises printing a paint on said copper substrate surface.
8. The process of claim 1 wherein said step of applying comprises roll coating a paint on said copper substrate surface.
9. The process of claim 1 wherein said step of applying includes:
mechanically and non-uniformly removing paint from said copper substrate surface using a brush.
10. A substrate colored according to the process of claim 1 .
11. The process of claim 1 wherein said applying step comprises the step of spraying said paint on said copper substrate surface.
12. The process of claim 1 wherein the step of applying comprises the step of non-uniformly spraying said paint on said copper substrate surface.
13. The process of claim 12 wherein the step of non-uniformly spraying comprises the step of varying the density of paint applied to said substrate.
14. The process of claim 12 wherein the step of non-uniformly spraying comprises the step of varying the relative movement of said substrate and paint spray.
15. The process of claim 12 wherein the step of non-uniformly spraying comprises the step of varying the volume of paint sprayed.
16. The process of claim 1 , wherein the paint selected and applied to the copper substrate includes an acrylic material.
17. The process of claim 1 , wherein the paint selected and applied to the copper substrate includes a polyester material.
18. The process of claim 1 , wherein the paint selected and applied to the copper substrate includes a urethane material.