IP Library Granted Patent US 7,902,557
Granted Patent B2
US 7,902,557 · App. 12/324,400 · Granted Mar 8, 2011

Semiconductor light emitting device and a method of manufacturing the same

Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 7,902,557
App. No.
12/324,400
Granted
Mar 8, 2011
Kind
B2
Abstract

Disclosed is a semiconductor light emitting device comprising a seed layer, a first conductive semiconductor layer into which the seed layer is partially inserted, a first electrode electrically connected to the first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, a second conductive semiconductor layer under the active layer, and a second electrode layer under the second conductive semiconductor layer.

Claims (29)

1. A semiconductor light emitting device comprising:

a seed portion;

a first conductive semiconductor layer into which the seed portion is partially embedded, and having a surface that exposes the seed portion;

a first electrode on the surface of the first conductive semiconductor layer;

an active layer under the first conductive semiconductor layer;

a second conductive semiconductor layer under the active layer; and

a second electrode under the second conductive semiconductor layer, and comprising at least one of reflective materials and a conductive support member.

2. The semiconductor light emitting device as claimed in claim 1 , wherein a lower surface of the seed portion comprises a circular shape or a polygonal shape.

3. The semiconductor light emitting device as claimed in claim 1 , wherein an upper surface of the seed portion is aligned on a same plane with an upper surface of the first conductive semiconductor layer, or is aligned on a plane different from the upper surface of the first conductive semiconductor layer.

4. The semiconductor light emitting device as claimed in claim 1 , wherein the seed portion comprises an undoped semiconductor layer.

5. The semiconductor light emitting device as claimed in claim 1 , wherein the seed portion is formed along the first conductive semiconductor layer in at least one of a strip shape, a matrix shape, a net shape, a circular shape and a polygonal shape.

6. A semiconductor light emitting device comprising:

a first conductive semiconductor layer comprising a concave portion comprising at least one of a strip shape, a matrix shape, a net shape, a circular shape and a polygonal shape;

a first electrode on the first conductive semiconductor layer;

an active layer under the first conductive semiconductor layer;

a second conductive semiconductor layer under the active layer; and

a second electrode under the second conductive semiconductor layer, and comprising at least one of reflective materials and a conductive support member.

7. The semiconductor light emitting device as claimed in claim 6 , comprising an undoped semiconductor layer partially formed the concave portion of the first conductive semiconductor layer.

8. The semiconductor light emitting device as claimed in claim 6 , wherein the first conductive semiconductor layer comprises at least one concave portion, and the concave portion has a depth smaller than a thickness of the first conductive semiconductor layer.

9. The semiconductor light emitting device as claimed in claim 6 , comprising a seed portion is formed in the concave portion of the first conductive semiconductor layer and the seed portion comprises at least one of a strip shape, a matrix shape, a net shape, a circular shape and a polygonal shape.

10. The semiconductor light emitting device as claimed in claim 6 , wherein the first conductive semiconductor layer comprises an N type semiconductor layer or a P type semiconductor layer.

11. The semiconductor light emitting device as claimed in claim 7 , wherein the first conductive semiconductor layer and the seed portion have a roughness.

12. The semiconductor light emitting device as claimed in claim 1 , wherein the seed portion is formed at regular intervals or irregular intervals.

13. The semiconductor light emitting device as claimed in claim 1 , wherein the seed portion has a thickness of 1 Ř9 μm.

14. The semiconductor light emitting device as claimed in claim 9 , wherein an upper surface of the seed portion is aligned on a plane different from the upper surface of the first conductive semiconductor layer.

15. The semiconductor light emitting device as claimed in claim 6 , wherein the seed portion comprises at least one of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN.

16. The semiconductor light emitting device as claimed in claim 6 , wherein a surface of the seed portion is exposed on the first conductive semiconductor layer.

17. The semiconductor light emitting device as claimed in claim 6 , wherein the second electrode is formed at a local area of a lower part of the second conductive semiconductor layer.

18. The semiconductor light emitting device as claimed in claim 6 , wherein the second electrode comprises material having an ohmic contact and a seed metal.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 068839/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2008
From: LEE, JO YOUNG
To: LG INNOTEK CO., LTD.
Reel/Frame 021953/0604 →
Priority Claims (1)
KR 10-2007-0123830 · Nov 30, 2007 · national
Continuity (1)
Related Publication 20090140281A1 · Jun 4, 2009