IP Library Granted Patent US 8,377,556
Granted Patent B2
US 8,377,556 · App. 12/324,685 · Granted Feb 19, 2013

Material for growth of carbon nanotubes

Inventors: Adeline Chan (Singapore, SG); Ivan Teo (Singapore, SG); Zhonglin Miao (Singapore, SG); Shanzhong Wang (Singapore, SG); Vincenzo Vinciguerra (Biancavilla, IT)
Assignee: STMicroelectronics Asia Pacific Pte., Ltd.
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Quick Facts
Patent No.
US 8,377,556
App. No.
12/324,685
Granted
Feb 19, 2013
Kind
B2
Abstract

Systems and methods for creating carbon nanotubes are disclosed that comprise a growing a nanotube on a tri-layer material. This tri-layer material may comprise a catalyst and at least one layer of Ti. This tri-layer material may be exposed to a technique that is used to grow a nanotube on a material such as a deposition technique.

Claims (14)

1. A metal silicide structure, comprising:

a cobalt titanium disilicide (CoTiSi 2 ) formed on a silicon (Si) substrate by annealing a first layer comprising titanium (Ti), a second layer comprising a cobalt (Co), and a third layer over the second layer, wherein the third layer comprises titanium (Ti), wherein a monosilicide is formed by reaction of the cobalt in the second layer with at least the titanium in the first layer and the silicon substrate during annealing, and wherein the disilicide is formed by annealing the silicon substrate and the monosilicide; and

at least one carbon nanotube formed on the cobalt titanium disilicide.

2. The metal silicide structure of claim 1 , wherein the Ti in the first layer has a thickness ranging from 2 nm to 10 nm.

3. The metal silicide structure of claim 2 , wherein the second layer has a thickness ranging from 0.5 nm to 6 nm.

4. The metal silicide structure of claim 1 , wherein the monosilicide is formed by rapid thermal annealing of the first, second and third layers.

5. The metal silicide structure of claim 1 , wherein the disilicide is formed by two iterations of rapid thermal annealing, a first iteration performed on the substrate and the first, second and third layers and a second iteration performed on the substrate and the monosilicide.

6. The metal silicide structure of claim 1 , wherein the third layer forms a barrier against diffusion of oxygen.

7. A metal silicide structure, comprising:

cobalt titanium disilicide (CoTiSi 2 ) on a silicon substrate; and

a plurality of carbon nanotubes formed on the cobalt titanium disilicide.

8. The metal silicide of claim 7 , wherein the cobalt titanium disilicide comprises a disilicide formed by annealing a first layer comprising titanium on a silicon substrate, a second layer comprising cobalt over the titanium, and a third layer comprising titanium over the second layer, the substrate and the first, second and third layers annealed to form a monosilicide.

9. The metal silicide of claim 8 , wherein the cobalt titanium disilicide comprises a disilicide formed by removing unreacted metal after annealing the substrate and the first, second and third layers, and annealing the substrate and the monosilicide to form the disilicide.

10. The metal silicide of claim 8 , wherein the monosilicide comprises cobalt titanium monosilicide (CoTiSi).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2009
From: CHAN, ADELINE; TEO, IVAN; MIAO, ZHONGLIN; WANG, SHANZHONG; VINCIGUERRA, VINCENZO
To: STMICROELECTRONICS ASIA PACIFIC PTE., LTD.
Reel/Frame 022490/0123 →
Continuity (1)
Related Publication 20100129549A1 · May 27, 2010