IP Library Granted Patent US 7,703,875
Granted Patent B2
US 7,703,875 · App. 12/324,725 · Granted Apr 27, 2010

Printing nozzle arrangement having movement sensor

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Quick Facts
Patent No.
US 7,703,875
App. No.
12/324,725
Granted
Apr 27, 2010
Kind
B2
Abstract

A printing nozzle arrangement is provided having a substrate having a CMOS layer and a chamber with a fluid inlet and ejection port, a paddle within the chamber, an actuating arm pivotally coupled between the substrate and the paddle and having an arm portion electrically connected to the CMOS layer, and a movement sensor having a moving contact element associated with the arm portion and a fixed contact element associated with the substrate. The arm portion thermally expands when an electrical current is applied thereto via the CMOS layer causing pivoting of the actuating arm thereby displacing the paddle to cause ejection of fluid from the ejection port. The moving contact completes an electrical circuit when contacted with the fixed contact element when the actuating arm pivots to a predetermined extent.

Claims (12)

1. A printing nozzle arrangement comprising:

a substrate having a CMOS layer and a chamber with a fluid inlet and ejection port;

a paddle within said chamber;

an actuating arm pivotally coupled between the substrate and the paddle and having an arm portion electrically connected to the CMOS layer; and

a movement sensor having a moving contact element associated with the arm portion and a fixed contact element associated with the substrate, wherein the arm portion thermally expands when an electrical current is applied thereto via the CMOS layer causing pivoting of the actuating arm thereby displacing the paddle to cause ejection of fluid from the ejection port, and

the moving contact completes an electrical circuit when contacted with the fixed contact element when the actuating arm pivots to a predetermined extent,

wherein:

the fixed contact element is electrically connected to amplifier elements and to a microprocessor arrangement, the amplifier elements being defined by the CMOS layer,

the microprocessor arrangement is configured to test the actuating arm by applying an electrical current to the arm portion for a predetermined duration, the completion of the electrical circuit through contact of the moving and fixed contacts being indicative of a functional actuating arm, and

the microprocessor arrangement is configured to apply a current pulse, having an energy level significantly greater than that normally applied for fluid ejection, to the arm portion in an attempt to clear any fluid blockages associated with the chamber.

2. The nozzle arrangement of claim 1 , wherein the substrate includes a silicon substrate, a metal oxide semiconductor layer, a passivation layer and a non-corrosive dielectric coating/chamber-defining layer.

3. The nozzle arrangement of claim 1 , wherein the actuating arm is formed from a titanium-aluminum-nitride deposit on the substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028581/0924 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2008
From: SILVEBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 021974/0781 →