Anti-reflective coating with high optical absorption layer for backside contact solar cells

1. A method of fabricating a backside contact solar cell, the method comprising:

texturing a surface of a silicon substrate on a front side of the backside contact solar cell to create a textured front side surface, the backside contact solar cell having diffusion regions and metal contacts electrically coupled to the diffusion regions on a backside opposite the front side, the front side facing the sun during normal operation to collect solar radiation;

forming a passivation level comprising silicon dioxide over the textured front side surface;

forming a high-k silicon nitride layer over the passivation level, the high-k silicon nitride layer being configured to block at least 10% of UV radiation coming into the silicon substrate from the front side; and

forming a low-k silicon nitride layer over the high-k silicon nitride layer, the high-k silicon nitride layer being formed between the passivation level and the low-k silicon nitride layer.

2. The method of claim 1 wherein the high-k silicon nitride layer has an extinction coefficient of at least 0.03 to light at wavelengths of 400 nm and shorter and the low-k silicon nitride layer has an extinction coefficient of at most 0.03 to light at wavelengths of 400 nm and longer.

3. The method of claim 1 wherein the silicon substrate comprises an N-type silicon substrate.

4. The method of claim 1 wherein the passivation level comprises thermally grown silicon dioxide.

5. The method of claim 1 wherein the high-k silicon nitride has a thickness in the range of 1 nm to 100 nm.

6. A backside contact solar cell comprising:

a textured surface on a front side silicon substrate of the backside contact solar cell, the front side facing the sun during normal operation to collect solar radiation;

a passivation level formed on the textured surface;

a high optical absorption layer formed on the passivation level, the high optical absorption layer comprising silicon nitride and being configured to block at least 10% of UV radiation coming into the silicon substrate from the front side; and

a low optical absorption layer formed on the high optical absorption layer, the high optical absorption layer being between the low optical absorption layer and the passivation level.

7. The backside contact solar cell of claim 6 wherein the high optical absorption layer has an extinction coefficient of at least 0.03 to light at wavelengths of 400 nm and shorter and the low optical absorption layer has an extinction coefficient of at most 0.03 to light at wavelengths of 400 nm or longer.

8. The backside contact solar cell of claim 6 wherein the low optical absorption layer comprises low-k silicon nitride and the high optical absorption layer comprises high-k silicon nitride.

9. The backside contact solar cell of claim 6 wherein the passivation level comprises silicon dioxide.

10. The backside contact solar cell of claim 6 wherein the silicon substrate comprises N-type silicon.

11. The backside contact solar cell of claim 6 wherein the high optical absorption layer comprises high-k silicon nitride having an extinction coefficient of at least 0.03 to light having a wavelength of 400 nm or shorter.

12. The backside contact solar cell of claim 6 wherein the high optical absorption layer comprises high-k silicon nitride formed to a thickness in the range of 1 nm to 100 nm.

13. A method of fabricating a backside contact solar cell, the method comprising:

texturing a surface of a front side of a solar cell substrate of the backside contact solar cell to create a textured front side surface, the front side facing the sun during normal operation to collect solar radiation;

forming a passivation level over the textured front side surface;

forming a high optical absorption layer over the passivation level, the high optical absorption layer being configured to block at least 10% of UV radiation coming into the substrate from the front side the high optical absorption layer comprising silicon nitride; and

forming a low optical absorption layer over the high optical absorption layer, the high optical absorption layer being formed between the passivation level and the low optical absorption layer.

14. The method of claim 13 wherein the passivation level comprises thermally grown silicon dioxide.

15. The method of claim 13 wherein the low optical absorption layer comprises low-k silicon nitride having an extinction coefficient of at most 0.03 to light having a wavelength of 400 nm or longer.

16. The method of claim 13 wherein the high optical absorption layer comprises high-k silicon nitride having an extinction coefficient of at least 0.03 to light having a wavelength of 400 nm or shorter.

17. The method of claim 13 wherein the substrate comprises N-type silicon.

18. The method of claim 13 wherein the substrate comprises N-type silicon and the passivation level comprises silicon dioxide thermally grown on a surface of the N-type silicon.

19. The method of claim 13 wherein the high optical absorption layer comprises high-k silicon nitride formed to a thickness in the range of 1 nm to 100 nm.

20. A backside contact solar cell comprising:

a passivation level formed on a front side of a substrate of a backside contact solar cell;

a high optical absorption layer formed on the passivation level, the high optical absorption layer comprising silicon nitride and being configured to block UV radiation coming into the substrate from the front side; and

a low optical absorption layer formed on the high optical absorption layer and forming a multi-layer anti-reflection structure with the high optical absorption layer and the passivation level, the high optical absorption layer being between the passivation level and the low optical absorption layer.

21. The backside contact solar cell of claim 20 wherein the high optical absorption layer has an extinction coefficient of at least 0.03 to light at wavelengths of 400 nm and shorter.

22. The backside contact solar cell of claim 20 wherein the high optical absorption layer comprises high-k silicon nitride.

23. The backside contact solar cell of claim 20 wherein the passivation level is formed on a textured surface of the substrate.

24. The backside contact solar cell of claim 20 wherein the passivation level comprises silicon dioxide.