Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device
View Patent ↗An optoelectronic surface-mounted device is provided comprising a premolded casing having a first cavity and a second cavity and a leadframe to which a first electrooptical element and a second electrooptical element are mounted. The leadframe is embedded in the premolded casing. The first cavity is adapted for providing a first electromagnetic radiation path between a first waveguide and the first electrooptical element, wherein the second cavity is adapted for providing a second electromagnetic radiation path between a second waveguide and the second electrooptical element. The first cavity and the second cavity are formed in the premolded casing to decouple electromagnetic radiation propagating along the first electromagnetic radiation path from electromagnetic radiation propagating along the second electromagnetic radiation path.
1. An optoelectronic surface-mounted device, the optoelectronic surface-mounted device comprising:
a premolded casing having a first cavity and a second cavity;
a first electrooptical element and a second electrooptical element;
a cap element attached to the premolded casing, the cap element having a first retainer and a second retainer formed therein, the first and second retainers each having at least one mating feature formed therein that is configured to interlock with at least one respective mating feature formed on first and second optical waveguide termination devices disposed on ends of first and second optical waveguides, respectively, wherein the first and second retainers are aligned with the first and second cavities, respectively, such that when the first and second optical waveguide termination devices are interlocked with the first and second retainers, respectively, the ends of the first and second optical waveguides secured to the first and second termination devices are positioned over the first and second cavities, respectively; and
a leadframe to which the first electrooptical element and the second electrooptical element are mounted, wherein the leadframe is embedded in the premolded casing, and wherein the first cavity is adapted for providing a first electromagnetic radiation path between the first optical waveguide and the first electrooptical element, and wherein the second cavity is adapted for providing a second electromagnetic radiation path between the second optical waveguide and the second electrooptical element, and wherein at least a portion of the premolded casing disposed between the first and second cavities comprises a material that is opaque to a wavelength of electromagnetic radiation to be propagated alone the first and second electromagnetic radiation paths to decouple electromagnetic radiation propagating along the first electromagnetic radiation path from electromagnetic radiation propagating along the second electromagnetic radiation path.
2. The optoelectronic surface-mounted device of claim 1 , wherein the entire premolded casing is formed of an opaque material.
3. The optoelectronic surface-mounted device of claim 1 , wherein the first cavity and the second cavity are filled with a transparent material.
4. The optoelectronic surface-mounted device of claim 1 , further comprising:
a driver circuit, wherein the driver circuit is connected to the leadframe and at least connected to one of the first electrooptical element and the second electrooptical element for driving the at least one of the first electrooptical element and the second electrooptical element.
5. The optoelectronic surface-mounted device of claim 1 , wherein at least one of the first electrooptical element and the second electrooptical element is selected from the group consisting of electromagnetic radiation sources and electromagnetic radiation detectors.
6. The optoelectronic surface-mounted device of claim 1 , further comprising:
a lens element, wherein the lens element is mounted at least to one of the first retainer and the second retainer.
7. The optoelectronic surface-mounted device of claim 6 , wherein the lens element is adapted for being mounted at least to one of the first retainer and the second retainer by injecting molding.
8. The optoelectronic surface-mounted device of claim 6 , wherein the lens element is mounted at least to one of the first retainer and the second retainer so that the lens element extends into one of the first cavity and the second cavity.
9. The optoelectronic surface-mounted device of claim 1 , wherein the first retainer and the second retainer are shape coded to provide the at least one mating feature of the first and second retainers.
10. The optoelectronic surface-mounted device of claim 1 , wherein at least one of the first and second optical waveguide termination devices is selected from a group of optical waveguide termination devices consisting of snap fit connectors and bayonet nut connectors, and wherein the at least one mating feature formed in at least one of the first retainer and the second retainer is configured to mate with the optical waveguide termination device selected from the group.
11. The optoelectronic surface-mounted device of claim 1 , wherein the leadframe comprise a footprint selected from one of the group consisting of SOIC 8 footprints, SOIC 16 footprints, SOIC 24 footprints and SOIC 32 footprints.
12. A method of forming an optoelectronic surface-mounted device, the method comprising:
providing a premolded casing having a first cavity and a second cavity;
mounting a leadframe to a first electrooptical element and a second electrooptical element;
embedding the leadframe in the premolded casing;
providing a first electromagnetic radiation path between a first waveguide and the first electrooptical element;
providing a second electromagnetic radiation path between a second waveguide and the second electrooptical element; and
attaching a cap element to the premolded casing, the cap element having a first retainer and a second retainer formed therein, the first and second retainers each having at least one mating feature formed therein that is configured to interlock with at least one respective mating feature formed on first and second optical waveguide termination devices disposed on ends of first and second optical waveguides, respectively, wherein the first and second retainers are aligned with the first and second cavities, respectively, such that when the first and second optical waveguide termination devices are interlocked with the first and second retainers, respectively, the ends of the first and second optical waveguides having the first and second termination devices disposed thereon are positioned over the first and second cavities, respectively, and
wherein at least a portion of the premolded casing that is disposed between the first and second cavities comprises a material that is opaque to a wavelength of electromagnetic radiation to be propagated along the first and second electromagnetic radiation to decouple electromagnetic radiation propagating along the first electromagnetic radiation path from electromagnetic radiation propagating along the second electromagnetic radiation path.