IP Library Granted Patent US 8,124,257
Granted Patent B2
US 8,124,257 · App. 12/329,659 · Granted Feb 28, 2012

Substrate for recording medium, and magnetic recording medium using same

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Quick Facts
Patent No.
US 8,124,257
App. No.
12/329,659
Granted
Feb 28, 2012
Kind
B2
Abstract

A substrate for a recording medium suited for thermally assisted recording methods has a disc shape with a center hole and includes a silicon single-crystal supporting member; an SiO 2 film formed on the silicon single-crystal supporting member; a main face having a film thickness of the SiO 2 film thereon which is less than 10 nm; a substrate inner periphery end face adjacent to the center hole; a substrate inner periphery chamfer portion adjacent to the main face and to the substrate inner periphery end face; a substrate outer periphery end face positioned on the side of the main face opposite the substrate inner periphery end face; and a substrate outer periphery chamfer portion adjacent to the main face and to the substrate outer periphery end face. A magnetic recording medium includes at least the above substrate and a magnetic recording layer formed on the substrate.

Claims (14)

1. A magnetic recording medium that has a disc shape with a center hole, comprising:

a silicon single-crystal supporting member having

a main face,

a substrate inner periphery end face adjacent to the center hole,

a substrate inner periphery chamfer portion adjacent to the main face and to the substrate inner periphery end face,

a substrate outer periphery end face positioned on a side of the main face opposite the substrate inner periphery end face, and

a substrate outer periphery chamfer portion adjacent to the main face and to the substrate outer periphery end face;

an SiO 2 film formed on the silicon single-crystal supporting member; and

a magnetic recording layer formed on the supporting member for the magnetic recording medium;

wherein

a thickness of the SiO 2 film on the main face ranges from 2 nm to 8 nm, and

a thickness of the SiO 2 film on the substrate inner periphery end face and the substrate inner periphery chamfer portion ranges from 50 nm to 200 nm.

2. The magnetic recording medium according to claim 1 , wherein the SiO 2 film on the substrate outer periphery end face has a film thickness of 10 nm or less.

3. The magnetic recording medium according to claim 2 , wherein at least the SiO 2 film on the substrate inner periphery end face and the substrate inner periphery chamfer portion is formed by thermal oxidation of the silicon single-crystal supporting member.

Assignments (3)
CHANGE OF NAME Recorded Oct 10, 2011
From: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 027249/0159 →
MERGER Recorded Oct 10, 2011
From: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD. (MERGER)
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 027288/0820 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2009
From: TSUDA, KOUICHI
To: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
Reel/Frame 022304/0830 →