Electronic device, loop heat pipe and cooling device
View Patent ↗According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.
1. An electronic device comprising:
a housing;
a heat generating part in the housing; and
a heat pipe in the housing and sealing a fluid therein, wherein:
the heat pipe further comprises:
a heat receiving unit configured to deprive heat of the heat generating part by gasification of the fluid;
a heat radiating unit configured to release the heat received by the heat receiving unit by liquefying of the fluid;
a vapor flow path configured to couple the heat receiving unit and the heat radiating unit to each other and allows a gasified portion of the fluid to flow from the heat receiving unit towards the heat radiating unit;
a liquid returning flow path provided at a position distant from the vapor flow path, which couples the heat receiving unit and the heat radiating unit to each other and allows a liquefied portion of the fluid to flow from the heat radiating unit towards the heat receiving unit;
a wick configured to return the liquefied portion of the fluid from the heat radiating unit to the heat receiving unit;
a pair of plate members containing the wick therebetween, and attached to each other to make the heat receiving unit, the heat radiating unit, the vapor flow path and the liquid returning flow path annular around the wick; and
a frame unit provided on outer peripheries of the plate members,
wherein:
the wick comprises a main portion and a first projecting portion extending from the main portion, the first projecting portion projecting towards an inside of the heat receiving unit such as to divide the inside of the heat receiving unit into a first portion communicating to the vapor flow path and a second portion communicating to the liquid returning flow path, and
the heat receiving unit is thermally connected to the heat generating part at a position across the first portion and the first projecting portion.
2. The electronic device according to claim 1 , wherein the wick comprises a second projecting portion which projects from the first projecting portion to a position where it overlays with the heat generating part, and a thickness of the second projecting portion is a half or less of a thickness of the main portion.
3. The electronic device according to claim 2 , wherein the wick comprises a third projecting portion which projects from the main portion to an inside of the heat radiating part, and the third projecting portion projects to a position which partially overlays with a heat sink which promotes heat radiation in the heat radiating unit.
4. The electronic device according to claim 3 , wherein:
the liquid returning flow path comprises a first region in which the main portion of the wick is provided and a second region located distant from the main portion, and
the wick comprises a fourth projecting portion projecting from the main portion towards the second region, and a thickness of the fourth projecting portion is a half or less of the thickness of the main portion.
5. The electronic device according to claim 4 , wherein the fourth projecting portion projects to a position corresponding to the heat generating part.
6. A heat pipe in which a fluid is sealed, comprising:
a heat receiving unit configured to deprive heat of an external heat generating part by gasification of the fluid;
a heat radiating unit configured to release the heat to an outside received by the heat receiving unit by liquefying of the fluid;
a first flow path configured to couple the heat receiving unit and the heat radiating unit to each other and allows a gasified portion of the fluid to flow from the heat receiving unit towards the heat radiating unit;
a second flow path provided at a position distant from the first flow path, which couples the heat receiving unit and the heat radiating unit to each other and allows a liquefied portion of the fluid to flow from the heat radiating unit towards the heat receiving unit;
a wick configured to return the liquefied portion of the fluid from the heat radiating unit to the heat receiving unit;
a pair of plate members containing the wick therebetween, and attached to each other to make the heat receiving unit, the heat radiating unit, the first flow path and the second flow path annular around the wick; and
a frame unit provided on outer peripheries of the plate members,
wherein:
the wick comprises a main portion and a first projecting portion extending from the main portion, the first projecting portion projecting towards an inside of the heat receiving unit such as to divide the inside of the heat receiving unit into a first portion communicating to the first flow path and a second portion communicating to the second flow path, and
the heat receiving unit is thermally connected to the heat generating part at a position across the first portion and the first projecting portion.
7. The heat pipe according to claim 6 , wherein the wick comprises a second projecting portion which projects from the first projecting portion to a position where it overlays with the heat generating part, and a thickness of the second projecting portion is a half or less of a thickness of the main portion.
8. The heat pipe according to claim 7 , wherein the wick comprises a third projecting portion which projects from the main portion to an inside of the heat radiating part, and the third projecting portion projects to a position which partially overlays with a heat sink which promotes heat radiation in the heat radiating unit.
9. An electronic device comprising:
a housing;
a heat generating part in the housing; and
a heat pipe in the housing and sealing a fluid therein, heat pipe comprises:
a wick;
a heat receiving unit configured to receive heat from the heat generating part;
a heat radiating unit configured to release to an outside the heat received by the heat receiving unit;
a first flow path extending between the heat receiving unit and the heat radiating unit to allow a gasified portion of the fluid to flow from the heat receiving unit to the heat radiating unit;
a second flow path extending between the heat receiving unit and the heat radiating unit to allow a liquefied portion of the fluid to flow from the heat radiating unit to the heat receiving unit;
a pair of plate members containing the wick therebetween, and attached to each other to make the heat receiving unit, the heat radiating unit, the first flow path and the second flow path annular around the wick; and
a frame unit provided on outer peripheries of the plate members,
wherein:
the wick comprises a main portion and a first projecting portion extending from the main portion, the first projecting portion dividing an inside of the heat receiving unit into a first portion communicating to the first flow path and a second portion communicating to the second flow path, and
the heat receiving unit is thermally connected to the heat generating part at a position across the first portion and the first projecting portion.