Semiconductor device and method of manufacturing the same
View Patent ↗A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrode 9 is formed in a region outside of an element mounting region of a substrate 5 . The projected electrode 9 includes a protruding portion that protrudes from the front face of a molding resin portion 10 . The distal end of the protruding portion is a flat face 13 . In addition, a portion of the projected electrode 9 whose cross section is larger than the protruding portion is positioned inside the molding resin portion 10.
1. A semiconductor device comprising:
a substrate having a first surface and a second surface opposed to the first surface;
a semiconductor element mounted on the first surface of the substrate;
a molding resin on the first surface of the substrate;
first electrodes on the first surface of the substrate, the first electrode in a region outside of the semiconductor element; and
second electrodes under the second surface of the substrate,
wherein the semiconductor element has an upper surface and a side surface, the upper surface and the side surface of the semiconductor element being directly in contact with the molding resin,
the molding resin has a first depression corresponding to at least one of the first electrodes,
at least one of the first electrodes has an upper portion and a side portion, the upper portion of the first electrode exposed from the molding resin and at least a portion of the side portion of the first electrode being directly in contact with the molding resin, and
there is a second depression in the upper portion of the first electrode.
2. The semiconductor device according to claim 1 , wherein at least one of the first electrodes is circular in plan view.
3. The semiconductor device according to claim 1 , wherein the first electrodes are made of solder.
4. The semiconductor device according to claim 1 , wherein
the first electrode has a first portion which is the widest portion of the first electrode,
the second electrode has a second portion which is the widest portion of the second electrode, and
the first portion of the first electrode is wider than the second portion of the second electrode.
5. The semiconductor device according to claim 1 , wherein the second electrode is directly under the first electrode.
6. The semiconductor device according to claim 1 , wherein the second electrodes surround the semiconductor element in plan view.
7. The semiconductor device according to claim 1 , wherein the first electrodes surround the semiconductor element.
8. The semiconductor device according to claim 1 , wherein at least one of the first electrodes has a first region, a second region and a third region in cross-sectional view, the second region being between the first region and the third region, the first region being inside a periphery of the second region in plan view, and the third region being inside the periphery of the second region in plan view.
9. The semiconductor device according to claim 1 , further comprising:
an electrode terminal on the upper surface of the semiconductor element; and
a thin metallic wire connected to the electrode terminal of the semiconductor element,
wherein the semiconductor element has a lower surface connected to the first surface of the substrate by an adhesive.
10. The semiconductor device according to claim 1 , further comprising another semiconductor element mounted on the upper surface of the semiconductor element, the other semiconductor element having an upper surface and a side surface, the upper surface and the side surface of the other semiconductor element being directly in contact with the molding resin.
11. The semiconductor device according to claim 10 , wherein the other semiconductor element has a lower surface which is connected to the upper surface of the semiconductor element by a bump.
12. The semiconductor device according to claim 1 , wherein the semiconductor element has a lower surface connected to the first surface of the substrate by a bump.
13. The semiconductor device according to claim 1 , wherein at least one of the first electrodes has a portion which is exposed from the molding resin, the portion being lower than an upper surface of the molding resin.
14. A semiconductor apparatus comprising:
the semiconductor device according to claim 1 ; and
an other semiconductor device, the other semiconductor device comprising:
an other substrate having a third surface, and a fourth surface opposed to the third surface;
an other semiconductor element mounted on the third surface of the other substrate; and
third electrodes under the fourth surface of the other substrate,
wherein the third electrode of the other semiconductor device is connected to the upper portion of the first electrode of the semiconductor device at a connecting portion, the connecting portion being lower than an upper surface of the molding resin of the semiconductor device, and
the lowest portion of at least one of the third electrodes of the other semiconductor device is in the second depression of the first electrode of the semiconductor device.
15. The semiconductor apparatus according to claim 14 , wherein the height of the upper surface of the molding resin of the semiconductor device is substantially uniform, except for the connecting portion.
16. The semiconductor device according to claim 1 , wherein the first depression of the molding resin is at the upper portion of the first electrode.
17. The semiconductor device according to claim 1 , wherein the second depression of the first electrode is in contact with the first depression of the molding resin.
18. The semiconductor device according to claim 1 , wherein a width of the second depression is shorter than a width of the first depression.
19. The semiconductor device according to claim 1 , wherein a height of at least one of the first electrodes is higher than a height of at least one of the second electrodes.