Method of fabricating printhead assembly
View Patent ↗A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.
1. A method of fabricating a printhead assembly, said method comprising the steps of:
(i) providing a molded ink manifold having a manifold bonding surface for attachment of one or more printhead integrated circuits, said bonding surface having a plurality of ink outlets defined therein, said bonding surface having a plurality of fissures resulting from a molding process;
(ii) coating at least said manifold bonding surface with a polymer coating, thereby plugging said fissures; and
(iii) bonding one or more printhead integrated circuits to said manifold bonding surface.
2. The method of claim 1 , wherein said manifold bonding surface is substantially planar as a result of said polymer coating plugging said fissures.
3. The method of claim 1 , wherein said coating step coats the entire molded ink manifold with said polymer coating.
4. The method of claim 1 , wherein said polymer coating plugs internal fissures between ink supply passages defined in said ink manifold.
5. The method of claim 1 , wherein said polymer coating is selected from the group of polymers consisting of: polyimides, polyesters, epoxies, polyolefins, siloxanes and liquid crystal polymers.
6. The method of claim 1 , wherein said polymer coating comprises inorganic or organic additives for providing one or more of the following characteristics: wettability, adhesive bond strength, and scratch-resistance.
7. The method of claim 1 , wherein said coating step comprises any one of: dipping, spray coating or spin coating.
8. The method of claim 7 , wherein said coating step utilizes a polymer coating solution comprising an organic solvent.
9. The method of claim 7 , wherein said coating step is controlled to provide a polymer coating having a predetermined thickness.
10. The method of claim 1 , wherein said bonding step comprises:
bonding an adhesive film to said manifold bonding surface; and
bonding said printhead integrated circuits to said adhesive film.
11. The method of claim 10 , wherein said adhesive film is a laminated film comprising a central polymeric film sandwiched between first and second adhesive layers.