IP Library Granted Patent US 8,265,070
Granted Patent B2
US 8,265,070 · App. 12/335,226 · Granted Sep 11, 2012

System and method for implementing a multistage network using a two-dimensional array of tiles

Assignee: Oracle America, Inc.
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Quick Facts
Patent No.
US 8,265,070
App. No.
12/335,226
Granted
Sep 11, 2012
Kind
B2
Abstract

A network, including: a first tile having a processor, a first top brick connected to the processor, a first bottom brick, and a first intermediate brick; a second tile having a second intermediate brick and a second bottom brick; multiple connections connecting the first top brick with the second intermediate brick and the first intermediate brick with the second bottom brick using a passthrough on an intermediate tile between the first and second tiles, where the first, the intermediate, and the second tiles are positioned in a row; and a third tile having a plurality of caches connected to a third bottom brick, where the second and third tiles are positioned in a column, and the first bottom brick, the second bottom brick, and the third bottom brick belong to a bottom layer of the network, and where the first and second intermediate bricks belong to an intermediate layer of the network.

Claims (15)

1. A system for implementing a multistage network, comprising:

a first tile comprising a processor, a first top brick operatively connected to the processor, a first bottom brick, and a first intermediate brick;

a second tile comprising a second intermediate brick and a second bottom brick;

a first plurality of connections operatively connecting the first top brick with the second intermediate brick and the first intermediate brick with the second bottom brick using a passthrough on an intermediate tile between the first tile and the second tile, wherein the first tile, the intermediate tile, and the second tile are positioned in a row of a two-dimensional array; and

a third tile comprising a cache operatively connected to a third bottom brick, wherein the second tile and the third tile are positioned in a column of the two-dimensional array,

wherein the first bottom brick, the second bottom brick, and the third bottom brick are different bricks, and are associated with a bottom layer of the multistage network linking the processor and the cache, and

wherein the first intermediate brick and the second intermediate brick are associated with an intermediate layer of the multistage network.

2. The system of claim 1 , wherein the multistage network is an omega network.

3. The system of claim 1 , wherein the first tile, the second tile, and the third tile are chips within a multi-chip module (MCM).

4. The system of claim 1 , wherein the passthrough is implemented using a shifted set.

5. The system of claim 1 , wherein the first top brick, the first intermediate brick, and the first bottom brick are physically realized using a crossbar.

6. The system of claim 1 , wherein the first top brick, the first intermediate brick, and the first bottom brick are physically realized using nodes programmed based on a design of the multistage network.

7. The system of claim 1 , further comprising:

a second plurality of connections operatively connecting a second top brick of the second tile with a third intermediate brick of the third tile, and the second intermediate brick with the third bottom brick.

8. The system of claim 7 , wherein the second plurality of connections are implemented using proximity communication.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037311/0182 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2011
From: KHANDURI, PUNEET
To: SUN MICROSYSTEMS, INC.
Reel/Frame 025859/0762 →
Continuity (1)
Related Publication 20100150147A1 · Jun 17, 2010