Method for treating semiconductor processing components and components formed thereby

1. A method of denuding a semiconductor processing component comprising:

providing a semiconductor processing component having an outer surface portion formed by chemical vapor deposition of SiC;

removing a target portion of the outer surface portion, the outer surface portion having a skin impurity level and a bulk impurity level, wherein the skin impurity level is an average impurity level from 0 nm to 100 nm of depth into the outer surface portion, the bulk impurity level is measured at a depth of not less than 3.0 microns into the outer surface portion; and heat treating the component to diffuse impurities from a surface of the outer surface portion, whereby the skin impurity level is not greater than 80% of the bulk impurity level.

2. The method of claim 1 , further comprising forming a getter layer overlying the outer surface portion such impurities are driven into the getter layer during heat treating.

3. The method of claim 2 , wherein the getter layer has an impurity diffusion coefficient at least 102 times greater than an impurity diffusion coefficient of the outer surface portion.

4. The method of claim 2 , wherein the getter layer comprises silicon oxide formed by oxidation of the outer surface portion, or comprises polycrystalline silicon formed by deposition.

5. The method of claim 1 , wherein heat treatment is carried out at a temperature not less than 1150° C. for a period of not less than 5 hours.

6. The method of claim 1 , wherein heat treatment is carried out in the presence of a halide gas.

7. The method of claim 1 , wherein the skin impurity level is not greater than 70% of the bulk impurity level.

8. The method of claim 1 , wherein the skin impurity level is not greater than 100 ppb atoms Fe.