Optical transceiver module
View Patent ↗Provided is a metal casing structure capable of avoiding a cavity resonance at 10 GHz and 20 GHz by controlling an eigenmode frequency in an inner space of a casing without involving an increase in cost, and a 10 Gbit/s optical transceiver module which achieves reduction in unnecessary electromagnetic waves and cost. In the optical transceiver module, a metal casing having a cavity therein is formed by an upper casing ( 100 ) and a lower casing ( 101 ), a metal partition wall ( 103, 104 ) is provided on at least one of the upper casing ( 100 ) and the lower casing ( 101 ) near a central portion of the casing in a direction parallel to a direction connecting a front and a rear thereof, and a length of a gap between the partition wall ( 103, 104 ) and a printed circuit board ( 102 ) is adjusted.
1. An optical transceiver module, comprising:
an upper casing having an electrical conductivity;
a lower casing having an electrical conductivity;
a printed circuit board;
a receiver optical sub-assembly; and
a transmitter optical sub-assembly,
the upper casing and the lower casing forming a casing having a cavity in an inside thereof,
the printed circuit board, the receiver optical sub-assembly, and the transmitter optical sub-assembly being arranged in the inside of the casing,
the printed circuit board and each of the receiver optical sub-assembly and the transmitter optical sub-assembly being electrically connected with each other,
a connecting portion of an optical signal with respect to the receiver optical sub-assembly and the transmitter optical sub-assembly being provided at a front end portion of the casing,
the printed circuit board comprising an edge connector having an electrode arranged therein,
the edge connector of the printed circuit board being extended to an exterior from a slit opening provided on a rear end portion of the casing,
wherein a partition wall having an electrical conductivity is provided on at least one of the upper casing and the lower casing in a longitudinal direction, the partition wall being arranged at a central portion in a transverse direction of one of the upper casing and the lower casing and at a position opposed to the printed circuit board.
2. An optical transceiver module according to claim 1 , wherein
the partition walls are provided on both the upper casing and the lower casing, and
a minimum gap between each of the partition walls and the printed circuit board ranges from 0.25 mm to 1.0 mm.
3. An optical transceiver module according to claim 2 , wherein the minimum gap between each of the partition walls and the printed circuit board is 0.5 mm.
4. An optical transceiver module according to claim 1 , wherein
the partition walls are provided on both the upper casing and the lower casing, and
a minimum gap between each of the partition walls and the printed circuit board ranges from 0.75 mm to 1.5 mm.
5. An optical transceiver module according to claim 4 , wherein the minimum gap between each of the partition walls and the printed circuit board is 1.0 mm.
6. An optical transceiver module according to claim 1 , wherein outer structures of the upper casing and the lower casing are compliant with an XFP standard in MSA.
7. An optical transceiver module according to claim 1 , wherein at least one of the upper casing and the lower casing is integrally molded by die casting.
8. An optical transceiver module according to claim 1 , wherein
the partition wall is provided only on the upper casing, and
the minimum gap between the partition wall and the printed circuit board ranges from 0.25 mm to 1.5 mm.
9. An optical transceiver module according to claim 8 , wherein the minimum gap between the partition wall and the printed circuit board is 1.0 mm.
10. An optical transceiver module according to claim 1 , wherein
the partition wall is provided only on the upper casing, and
the minimum gap between the partition wall and the printed circuit board ranges from 0.5 mm to 1.0 mm.
11. An optical transceiver module according to claim 10 , wherein the minimum gap between the partition wall and the printed circuit board is 0.5 mm.
12. An optical transceiver module according to claim 8 , wherein outer structures of the upper casing and the lower casing are compliant with an XFP standard in MSA.
13. An optical transceiver module according to claim 8 , wherein the lower casing is manufactured by sheet metal working.
14. An optical transceiver module according to claim 1 , wherein
the outer structures of the upper casing and the lower casing are compliant with a SFP+ standard in MSA,
the partition walls are provided on both the upper casing and the lower casing, and
the minimum gap between each of the partition walls and the printed circuit board is 0.5 mm or less.
15. An optical transceiver module according to claim 14 , wherein the minimum gap between each of the partition walls and the printed circuit board is 0.25 mm.
16. An optical transceiver module according to claim 14 , wherein at least one of the upper casing and the lower casing is integrally molded by die casting.