IP Library Granted Patent US 7,780,302
Granted Patent B2
US 7,780,302 · App. 12/339,793 · Granted Aug 24, 2010

Method of forming and mounting an angled reflector

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Quick Facts
Patent No.
US 7,780,302
App. No.
12/339,793
Granted
Aug 24, 2010
Kind
B2
Abstract

In a method of forming a device so as to include a reflective surface at a specific angle to an incident optical axis, a region of a first major surface of a substrate is exposed to an anisotropic etchant to form a surface having the specific angle with respect to the first major surface, but the etched surface is then used as a mounting surface. That is, rather than anisotropically etching a reflective surface, the etching provides the mounting surface and the second major surface of the substrate functions as the reflective surface when the fabricated device is properly mounted. The substrate may be a <100> silicon wafer having a 9.74 degree off-axis cut. Then, a 45 degree mirror is formed by the process. When the reflector is used in an optical device, the <111> crystalline plane will be generally parallel to the surface of the support.

Claims (28)

1. An optical device comprising:

a support;

a first optical element configured to direct a beam of light along a first axis that is parallel to said support; and

a reflector comprising:

a polished surface oriented at an angle of substantially 45 degrees to said support, said polished surface configured to intercept the beam of light directed along said first axis, and reflect the intercepted beam of light along a second axis that is oriented substantially at 90 degrees with reference to the first axis; and

an etched surface used as a mounting surface for mounting said reflector on said support, the etched surface formed on a <111> crystalline plane oriented at an angle of substantially 45 degrees to the polished surface of said reflector.

2. The optical device of claim 1 , wherein said polished surface is formed on an external surface of a silicon wafer.

3. The optical device of claim 2 , wherein said silicon wafer is a 9.74 degree off-axis cut <100> silicon wafer.

4. The optical device of claim 2 , wherein said external surface of said silicon wafer has a surface smoothness that is greater than 5 nm.

5. The optical device of claim 1 , wherein said polished surface has a better surface smoothness compared to said etched surface as a result of polishing said polished surface and precluding etching of said polished surface.

6. The optical device of claim 1 , wherein said polished surface precludes any etched portion.

7. The optical device of claim 1 further comprising a second optical element configured to intercept the beam of light propagated along the second axis after reflection by the reflector.

8. The optical device of claim 7 , wherein said first optical element is a light source and said second optical element is an optical fiber.

9. The optical device of claim 7 , wherein said second optical element is a lens.

10. The optical device of claim 1 , wherein said reflector further comprises a toe portion having a toe portion surface that shares a first edge with said polished surface and shares a second edge with said etched surface.

11. The optical device of claim 10 , wherein said toe portion is configured to accommodate positioning of said first optical element at a desirable distance from said polished surface of said reflector.

12. An optical device comprising:

a support; and

a reflector comprising:

a polished surface oriented at an angle of substantially 45 degrees to said support, said polished surface configured to receive a beam of light traveling along a first axis and reflect the beam of light along a second axis that is oriented substantially at 90 degrees with reference to the first axis; and

an etched surface used as a mounting surface for mounting said reflector on said support, the etched surface formed on a <111> crystalline plane oriented at an angle of substantially 45 degrees to the polished surface of said reflector.

13. The optical device of claim 12 further comprising:

a first optical element configured to at least one of a) receive or b) emit, the beam of light along the first axis; and

a second optical element configured to at least one of a) emit or b) receive respectively, the beam of light along the second axis.

14. The optical device of claim 13 , wherein:

said first axis is parallel to said support;

said first optical element is at least one of a) a light source or b) an optical fiber; and

said second optical element is at least one of a) a corresponding optical fiber or b) a corresponding light source respectively.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 47630 FRAME: 344. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 21, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0267 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 9/5/2018 PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0687. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0344 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
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TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
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