Methods for creating slanted perpendicular magnetic pole via metal liftoff

1. A method, comprising:

forming a resist structure above an upper surface of a substrate, wherein a portion of the upper surface of the substrate is a shaping layer, wherein the resist structure has an undercut;

depositing a layer of magnetic material above exposed regions of the substrate, wherein a portion of the layer of magnetic material tapers towards the substrate as it approaches the undercut,

wherein a portion of the layer of magnetic material is positioned in the undercut;

removing the resist structure; and

forming a write pole above the layer of magnetic material.

2. The method as recited in claim 1 , further comprising forming the shaping layer and planarizing the shaping layer and surrounding material for forming the upper surface of the substrate.

3. The method as recited in claim 1 , wherein the resist structure is a bilayer photoresist comprising a photoresist and a release layer.

4. The method as recited in claim 1 , wherein a mean slope of the tapered surface of the layer of magnetic material is between about 6 and about 15 degrees relative to a plane of deposition thereof.

5. The method as recited in claim 1 , wherein forming the write pole above the layer of magnetic material includes forming a write pole layer, masking the write pole layer for defining the write pole, and removing unmasked areas of the write pole layer.

6. The method as recited in claim 1 , wherein the layer of magnetic material is formed by at least one of plasma vapor deposition and ion beam deposition.

7. The method as recited in claim 1 , further comprising lapping the layer of magnetic material for defining an air bearing surface end in a region thereof that is tapered.

8. A method, comprising:

forming a resist structure above an upper surface of a substrate, wherein a portion of the upper surface of the substrate is a shaping layer, wherein the resist structure has an undercut;

depositing a layer of magnetic material above exposed regions of the substrate, wherein a portion of the layer of magnetic material tapers towards the substrate as it approaches the undercut;

removing the resist structure; and

forming a write pole above the layer of magnetic material,

wherein a portion of the layer of magnetic material is positioned in the undercut.

9. A method, comprising:

forming a resist structure above an upper surface of a substrate, wherein a portion of the upper surface of the substrate is a shaping layer, wherein the resist structure has an undercut;

depositing a layer of magnetic material above exposed regions of the substrate, wherein a portion of the layer of magnetic material tapers towards the substrate as it approaches the undercut;

removing the resist structure; and

forming a write pole above the layer of magnetic material,

wherein removing the resist structure includes baking the resist structure for creating cracks in any overlying material, and contacting a release layer of the resist structure with a solvent.

10. The method as recited in claim 9 , further comprising removing portions of the layer of magnetic material not underlying the mask.

11. A method, comprising:

forming a shaping layer;

planarizing the shaping layer and a surrounding material for defining an upper surface of a substrate;

forming a bilayer resist structure above the upper surface of the substrate, wherein the resist structure has an undercut;

depositing a layer of magnetic material above exposed regions of the substrate, wherein a portion of the layer of magnetic material tapers towards the substrate as it approaches the undercut, wherein a portion of the layer of magnetic material is positioned in the undercut;

removing the resist structure;

forming a write pole layer above the layer of magnetic material;

masking the write pole layer for defining the write pole; and

removing unmasked areas of the write pole layer.

12. The method as recited in claim 11 , wherein the bilayer resist structure comprises a photoresist and a release layer.

13. The method as recited in claim 11 , wherein a mean slope of the tapered surface of the layer of magnetic material is between about 6 and about 15 degrees relative to a plane of deposition thereof.

14. The method as recited in claim 11 , further comprising removing portions of the layer of magnetic material not underlying the mask.

15. The method as recited in claim 11 , wherein the layer of magnetic material is formed by at least one of plasma vapor deposition and ion beam deposition.

16. A method, comprising:

forming a shaping layer;

planarizing the shaping layer and a surrounding material for defining an upper surface of a substrate;

forming a bilayer resist structure above the upper surface of the substrate, wherein the resist structure has an undercut;

depositing a layer of magnetic material above exposed regions of the substrate, wherein a portion of the layer of magnetic material tapers towards the substrate as it approaches the undercut, wherein a portion of the layer of magnetic material is positioned in the undercut;

removing the resist structure;

forming a write pole layer above the layer of magnetic material;

masking the write pole layer for defining the write pole; and

removing unmasked areas of the write pole layer,

wherein removing the resist structure includes baking the resist structure for creating cracks in any overlying material, and contacting a release layer of the resist structure with a solvent.

17. The method as recited in claim 11 , further comprising lapping the layer of magnetic material for defining an air bearing surface end in a region thereof that is tapered.

18. A method, comprising:

forming a resist structure above an upper surface of a substrate, wherein a portion of the upper surface of the substrate is a shaping layer, wherein the resist structure has an undercut;

depositing a layer of magnetic material above exposed regions of the substrate, wherein a portion of the layer of magnetic material tapers towards the substrate as it approaches the undercut, wherein a portion of the layer of magnetic material is positioned in the undercut;

removing the resist structure; and

forming a write pole above the layer of magnetic material,

wherein removing the resist structure includes baking the resist structure for creating cracks in any overlying material, and contacting a release layer of the resist structure with a solvent.

19. The method as recited in claim 18 , further comprising removing portions of the layer of magnetic material not underlying the mask.