IP Library Granted Patent US 8,236,916
Granted Patent B1
US 8,236,916 · App. 12/343,200 · Granted Aug 7, 2012

Polysilane compositions, methods for their synthesis and films formed therefrom

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Quick Facts
Patent No.
US 8,236,916
App. No.
12/343,200
Granted
Aug 7, 2012
Kind
B1
Abstract

Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane generally has the formula H-[(AHR) n (c-A m H pm-2 ) q ]—H, where each instance of A is independently Si or Ge; R is H, -A a H a+1 R a , halogen, aryl or substituted aryl; (n+a)≧10 if q=0, q≧3 if n=0, and (n+q)≧6 if both n and q≠0; p is 1 or 2; and m is from 3 to 12. In one aspect, the method generally includes the steps of combining a silane compound of the formula AH a R 1 4-a , the formula A k H g R 1′ h and/or the formula c-A m H pm R 1 rm with a catalyst of the formula R 4 x R 5 y MX z (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. In another aspect, the method includes the steps of halogenating a polyarylsilane to form a halopolysilane; and reducing the halopolysilane with a metal hydride to form the polysilane. The synthesis of semiconductor inks via dehydrocoupling of silanes and/or germanes allows for tuning of the ink properties (e.g., viscosity, boiling point, and surface tension) and for deposition of silicon films or islands by spincoating, inkjetting, dropcasting, etc., with or without the use of UV irradiation.

Claims (26)

1. A composition, comprising a polymer having a linear chain of at least 15 A atoms and H, Cl, or Br atoms bound thereto, and when the chain contains at least one Ge atom, each Si and Ge atom in the polymer may have an aryl group or substituted aryl group bound thereto; and a cyclic compound of the formula c-A m R 2m , wherein each instance of A is independently Si or Ge, m is an integer from 3 to 12, and each instance of R is independently H, Cl, or Br.

2. The composition of claim 1 , wherein said polymer comprises blocks of the formula -(AH 2 )— and/or -(A k H 2k )—, wherein k is an integer from 2 to 12.

3. The composition of claim 2 , further comprising a polysilane that comprises blocks of the formula -(c-Si n H 2n-2 )—, where n is independently an integer from 5 to 8.

4. The composition of claim 2 , wherein A is Si, and k is an integer from 5 to 10.

5. The composition of claim 1 , wherein the polymer includes at least one block of the formula -(A k H 2k )—, wherein k is an integer from 2 to 12.

6. The composition of claim 5 , where k is an integer of from 5 to 10.

7. The composition of claim 1 , wherein said polymer comprises at least one block of the formula -(AHR 3 ) q — or -(A p H g-2 R 3 h )—, at least one instance of A is Ge, R 3 is independently H, Cl, aryl, or substituted aryl p is an integer from 2 to 12, g≧2 and (g+h)=2k+2.

8. The composition of claim 7 , wherein g=(k+2), 2k or (2k+2).

9. The composition of claim 1 , wherein the chain consists essentially of blocks of the formula —(SiH 2 ) p — and/or —(Si k H 2k )—, where p is ≦50, and k is an integer from 5 to 10.

10. The composition of claim 1 , wherein the viscosity of the composition is greater than 4 cP.

11. The composition of claim 1 , further comprising one or more solvents selected from the group consisting of C 6 -C 12 monocycloalkanes, C 10 -C 14 dicycloalkanes, and C 10 -C 14 tricycloalkanes.

12. The composition of claim 11 , wherein said polymer and said cyclic compound are soluble in said one or more solvents.

13. The composition of claim 1 , wherein said polymer consists essentially of silicon and hydrogen.

14. The composition of claim 1 , wherein R is H.

15. The composition of claim 1 , wherein said polymer comprises at least one block of the formula —(Si k H g-2 R h )—, wherein k is an integer from 2 to 12, g≧2 and (g+h)=2k+2, and each instance of R is independently H, Cl, or Br.

16. The composition of claim 15 , wherein g=(k+2), 2k, or (2k+2), and k is an integer of from 5 to 10.

17. The composition of claim 1 , wherein said polymer consists essentially of repeating —(Si k H 2k )— units, where k is an integer from 5 to 10.

18. The composition of claim 1 , wherein the polymer is produced by halogenating a mixture of polyphenylsilanes to form a mixture of polychlorosilanes, and then reducing the mixture of polychlorosilanes to form the polymer.

19. The composition of claim 18 , wherein halogenating the mixture of polyphenylsilanes comprises exposing the polyphenylsilanes to AlCl 3 and HCl, and reducing the mixture of polychlorosilanes comprises exposing the polychlorosilanes to LiAlH 4 .

20. The composition of claim 1 , wherein a 15% solution of said polymer and said cyclic compound in cyclooctane does not precipitate within 3 days at 50° C.

21. The composition of claim 1 , wherein the polymer, or precursors thereof, is catalytically synthesized.

22. The composition of claim 1 , further comprising a solvent in which the polymer and said cyclic compound are soluble.

23. The composition of claim 22 , wherein the composition comprises about 0.5% to about 50% of the polymer by volume.

24. The composition of claim 22 , wherein the composition comprises about 0.5% to about 50% of the polymer by weight.

25. The composition of claim 22 , wherein the composition comprises about 5% to about 30% of the polymer by volume.

26. The composition of claim 22 , wherein the composition comprises about 5% to about 30% of the polymer by weight.

Assignments (3)
CHANGE OF NAME Recorded Aug 22, 2022
From: THIN FILM ELECTRONICS ASA
To: ENSURGE MICROPOWER ASA
Reel/Frame 061298/0249 →
SECURITY INTEREST Recorded Jun 9, 2020
From: THIN FILM ELECTRONICS, INC.; THIN FILM ELECTRONICS, ASA
To: UTICA LEASECO, LLC
Reel/Frame 053472/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2014
From: KOVIO, INC.
To: THIN FILM ELECTRONICS ASA
Reel/Frame 032126/0931 →