IP Library Granted Patent US 8,197,774
Granted Patent B2
US 8,197,774 · App. 12/343,973 · Granted Jun 12, 2012

Microchip

Assignee: Rohm Co., Ltd.
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Quick Facts
Patent No.
US 8,197,774
App. No.
12/343,973
Granted
Jun 12, 2012
Kind
B2
Abstract

A microchip is provided, in which dead space provided only for holding excess fluid is made smaller. The microchip is formed by joining at least a first substrate with a trench formed on the substrate surface and a second substrate, and it has a fluid circuit formed by the trench and a surface of the second substrate facing the first substrate. The first substrate and/or the second substrate has a projection for moving fluid and/or air in a direction opposite to the direction of gravity during an operation of the microchip, and the projection is provided near an end portion of a through hole and/or an air vent.

Claims (22)

1. A microchip comprising a first substrate joined to a second substrate, the first substrate including a trench in its surface, wherein the trench and a surface of said second substrate facing said first substrate form first and second fluid circuits, the microchip further comprising:

a through hole or air vent in one of the substrates so as to connect the fluid circuits to outside the microchip, wherein the first fluid circuit is located to a first side of the through hole or air vent and wherein the second fluid circuit is located to a second side of the through hole or air vent,

a first projection located at a position between the first fluid circuit and the through hole or air vent, and a second projection located at a position between the second fluid circuit and the through hole or air vent,

wherein a separation distance between the first projection and a surface of one of the substrates is smaller than a separation distance between the second projection and the surface of the one of the substrates.

2. The microchip of claim 1 wherein at least one of the projections has an inclined sidewall near said through hole or air vent.

3. The microchip according to claim 2 , wherein-the inclined sidewall of said projection is inclined with respect to said first substrate.

4. The microchip of claim 1 wherein the through hole or air vent connecting said fluid circuit to the outside of said microchip is in the first substrate; and

the projections arc on a surface of said first substrate.

5. The microchip according to claim 4 , wherein surfaces forming each of the projections are inclined with respect to said second substrate.

6. A microchip comprising a first substrate joined to a second substrate, and a third substrate joined to the first substrate, wherein said first substrate has trenches formed on opposite surfaces;

the microchip further comprising:

a first fluid circuit formed by a first one of the trenches and a surface of said second substrate facing said first substrate, and

a plurality of second fluid circuits formed by a second one of the trenches and a surface of said third substrate facing said first substrate;

wherein said first substrate has a through hole connecting said first fluid circuit and said second fluid circuits;

first and second projections on the first substrate extending respectively toward the third substrate,

wherein the first projection is located at a position between a first one of the second fluid circuits and the through hole, and the second projection is located at a position between a second one of the second fluid circuits and the through hole, and

wherein a separation distance between the first projection and a surface of the third substrate is smaller than a separation distance between the second projection and the surface of the third substrate.

7. The microchip according to claim 6 , further comprising

a first wall surface connecting the surface of said second substrate forming said first fluid circuit and an inner wall forming said through hole, and shutting off said first fluid circuit; wherein

said first wall surface and the inner wall forming said through hole are inclined to said third substrate.

8. The microchip according to claim 6 , wherein a respective surface of each of the projections facing the through hole is inclined with respect to said third substrate.

9. The microchip of claim 6 wherein a cross-section of the through hole in a direction parallel to a top surface of said microchip is smaller than a cross-section of the first fluid circuit in a direction parallel to the top surface of said microchip.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2019
From: ROHM CO., LTD.
To: HORIBA, LTD.
Reel/Frame 049049/0016 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2009
From: YOKOGAWA, AKINORI; MOMOSE, SHUN
To: ROHM CO., LTD.
Reel/Frame 022453/0786 →
Priority Claims (2)
JP 2007-337274 · Dec 27, 2007 · national
JP 2007-339571 · Dec 28, 2007 · national
Continuity (1)
Related Publication 20090232708A1 · Sep 17, 2009