Graphene electronics fabrication
View Patent ↗An electrical circuit structure employing graphene as a charge carrier transport layer. The structure includes a plurality of graphene layers. Electrical contact is made with one of the layer of the plurality of graphene layers, so that charge carriers travel only through that one layer. By constructing the active graphene layer within or on a plurality of graphene layers, the active graphene layer maintains the necessary planarity and crystalline integrity to ensure that the high charge carrier mobility properties of the active graphene layer remain intact.
1. A circuit structure comprising:
a plurality of layers of graphene formed one on another; and
first and second electrical contacts, both of the first and second electrical contacts being electrically connected with a single graphene layer of the plurality of layers of graphene, wherein at least a portion of the plurality of graphene layers have first and second edges that define first and second sides, and wherein the single layer of graphene extends beyond the first and second sides.
2. The circuit structure as in claim 1 wherein the single graphene layer is at the top of the plurality of graphene layers.
3. The circuit structure as in claim 1 wherein the single graphene layer is at the bottom of the plurality of graphene layers.
4. The circuit structure as in claim 1 wherein the single graphene layer within the plurality of graphene layers is sandwiched between adjacent graphene layers.
5. The circuit structure as in claim 1 wherein the plurality of graphene layers includes at least three layers of graphene.
6. The circuit structure as in claim 1 wherein the plurality of graphene layers is formed on a substrate.
7. The circuit structure as in claim 1 wherein the plurality of graphene layers is formed on a Si substrate.
8. The circuit structure as in claim 1 wherein the single graphene layer makes contact with the first and second electrical contacts in a region beyond the first and second sides.
9. The circuit structure as in claim 1 further comprising an electrically insulating layer formed on the first and second sides.
10. The circuit structure as in claim 8 further comprising an electrically insulting material formed between each of the first and second sides and an adjacent one of the electrical contacts.