IP Library Granted Patent US 8,626,310
Granted Patent B2
US 8,626,310 · App. 12/347,540 · Granted Jan 7, 2014

External RF telemetry module for implantable medical devices

Inventors: Michael William Barror (Gilbert, AZ); William D. Verhoef (Andover, MN); Joyce K. Yamamoto (Maple Grove, MN); Robert S. Wentink (Lino Lakes, MN); Gregory J. Haubrich (Champlin, MN)
Assignee: Medtronic, Inc.
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Quick Facts
Patent No.
US 8,626,310
App. No.
12/347,540
Granted
Jan 7, 2014
Kind
B2
Abstract

An implantable medical device (“IMD”) is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing.

Claims (15)

1. An implantable medical device (“IMD”), comprising:

a hermetic housing having an exterior surface that defines a recessed region having a plurality of side surfaces and a bottom surface, wherein the hermetic housing further comprises at least one filtered feedthrough conductive path through the bottom surface of the recessed region; and

an integrated antenna and telemetry module assembly, wherein the integrated antenna and telemetry module assembly comprises:

a hermetic cover that comprises ceramic;

an antenna embedded within the ceramic of the hermetic cover; and

a telemetry module attached to the hermetic cover and communicatively coupled with the antenna;

wherein the recessed region is configured to receive the integrated antenna and telemetry module such that the hermetic cover is sealed against the plurality of side surfaces of the recessed region of the hermetic housing, and the telemetry module is enclosed within the recessed region and covered by the hermetic cover when the hermetic cover is sealed against the plurality of side surfaces of the recessed region of the hermetic housing; and

wherein the at least one filtered feedthrough conductive path extending through the bottom surface of the recessed region communicatively couples the telemetry module to at least one component within the housing.

2. The implantable medical device of claim 1 , wherein the telemetry module is conformally shaped to the recessed region of the hermetic housing.

3. The implantable medical device of claim 1 , wherein the at least one filtered feedthrough conductive path prevents undesired interference signals from entering the hermetic housing through the filtered feedthrough conductive path coupled to the telemetry module.

4. The implantable medical device of claim 1 , wherein the ceramic material and antenna are cofired together into a monolithic structure.

5. The implantable medical device of claim 1 , wherein the telemetry module comprises a shielding layer for providing at least one of electromagnetic interference (EMI) and electromagnetic capability (EMC) isolation for the telemetry module.

6. The implantable medical device of claim 1 , wherein the telemetry module is a potted external flex radio frequency (RF) module having self-contained RF circuitry and digital circuitry.

7. The implantable medical device of claim 6 , wherein a telemetry module and the antenna are integrated together in the potted external flex radio frequency (RF) module.

8. The implantable medical device of claim 1 , wherein the IMD further comprises a header coupled to the housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2009
From: BARROR, MICHAEL W.; VERHOEF, WILLIAM D.; WENTINK, ROBERT S.; HAUBRICH, GREGORY J.; YAMAMOTO, JOYCE K.
To: MEDTRONIC, INC.
Reel/Frame 023033/0429 →
Continuity (1)
Related Publication 20100168818A1 · Jul 1, 2010