Organic light-emitting device and method for forming the same
View Patent ↗An organic light-emitting device and a method for forming the same are provided. The organic light-emitting device includes: a substrate including a pixel area and a peripheral circuit area; a passivation layer on the substrate, the passivation layer including a first part in the pixel area and a second part in the peripheral circuit area; a pixel definition layer defining a plurality of pixel openings corresponding to the pixel area of the substrate; a plurality of first electrodes in the pixel openings; an adhesion layer on the second part; an organic layer on the first electrodes; and a second electrode layer on the organic light emitting layer, wherein the second electrode extends to the peripheral circuit area to connect with the adhesion layer.
1. A method for forming an organic light-emitting device, comprising:
providing a substrate having a pixel area and a peripheral circuit area;
forming a passivation layer on said substrate, said passivation layer having a first part in said pixel area and a second part in said peripheral circuit area;
forming a pixel definition layer on said first part, said pixel definition layer defining a plurality of pixel openings;
forming a first electrode in a corresponding one of said pixel openings;
forming an adhesion layer on said second part;
forming an organic light emitting layer on said first electrode; and
forming a second electrode layer on said organic light emitting layer, said second electrode layer extending to said peripheral circuit area to connect with said adhesion layer;
wherein said adhesion layer includes a material having similar characteristic with one of said first electrode and said second electrode layer.
2. The method of claim 1 , wherein said step of forming said first electrode and said step of forming said adhesion layer are performed simultaneously.
3. The method of claim 1 , wherein said step of forming said first electrode and said step of forming said adhesion layer are performed separately.
4. The method of claim 1 , wherein said step of forming said passivation layer further comprises a step of forming said second part to define a contact opening.
5. The method of claim 4 , wherein said second electrode layer is electrically connected to a circuit layer on said peripheral circuit area through said contact opening.
6. The method of claim 4 , further comprising a step of forming a conductive layer in said contact opening, said conductive layer electrically connecting to a circuit layer on said peripheral circuit area.
7. The method of claim 6 , wherein said second electrode layer is formed on said conductive layer and electrically connected to said conductive layer.
8. The method of claim 1 , further comprising a step of forming a protective layer on said second electrode layer.
9. The method of claim 1 , wherein said adhesion layer is formed as a sealing layer surrounding said pixel area.