Package for electronic component and piezoelectric resonator
View Patent ↗A package for electronic component includes: a rectangular package body, a lid hermetically sealing the package body, an electrode pad provided in the package body, a mounting terminal provided at least near four corners of a bottom surface of the package body and having a bump on a mounting surface, and a plurality of coupling electrodes electrically coupling the pad to the mounting terminal.
1. A package for electronic component, comprising:
a rectangular package body;
a lid hermetically sealing the package body;
an electrode pad provided in the package body;
a mounting terminal provided at least near a corner of a mounting surface of the package body and having a raised portion on the mounting surface, a thickness of the raised portion being greater than a thickness of the mounting terminal; and
a coupling electrodes electrically coupling the pad to the mounting terminal.
2. The package for electronic component according to claim 1 , further comprising a castellation at the corner of the package body, the coupling electrodes being provided to the castellation.
3. The package for electronic component according to claim 1 , wherein, if the mounting terminal is joined to a circuit substrate with solder, the raised portion on the mounting terminal has such a shape that the solder is thickened at a periphery of the corner.
4. The package for electronic component according to claim 1 , further comprising a pair of dummy electrodes provided to the package.
5. The package for electronic component according to claim 4 , further comprising more than one pair of dummy electrodes.
6. A piezoelectric resonator, comprising:
the package for electronic component according to claim 1 ; and
a piezoelectric resonator element mounted on the electrode pad of the package body.
7. The package for electronic component according to claim 1 , wherein
a length and a width of the mounting terminal are greater than a length and a width of the raised portion.