ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
An acoustic wave device includes a substrate; an acoustic wave element provided on the substrate; a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element; a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal; a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element; a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer; a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and a solder ball provided on the metal post.
1 . An acoustic wave device comprising:
a substrate;
an acoustic wave element provided on the substrate;
a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element;
a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal;
a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element;
a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer;
a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and
a solder ball provided on the metal post.
2 . The acoustic wave device as claimed in claim 1 , wherein a length from the region where the third opening and the second opening are overlapped with each other to one end of the third opening on the cavity side is larger than a length from the region where the third opening and the second opening are overlapped with each other to the other end of the third opening.
3 . The acoustic wave device as claimed in claim 1 , wherein height from the substrate to an upper face of the metal post is lower than that from the substrate to an upper face of the third insulating layer.
4 . The acoustic wave device as claimed in claim 1 , wherein an opening length of the third opening is larger than a length of the terminal.
5 . The acoustic wave device as claimed in claim 1 , wherein an opening length of the first opening is equal to that of the second opening.
6 . The acoustic wave device as claimed in claim 5 , wherein the first opening corresponds to the second opening.
7 . The acoustic wave device as claimed in claim 1 , wherein the first insulating layer, the second insulating layer and the third insulating layer are made of photosensitive resin.
8 . The acoustic wave device as claimed in claim 1 , wherein the acoustic wave element is a surface acoustic wave element or a piezoelectric thin film resonator.
9 . A method of manufacturing an acoustic wave device comprising:
providing an acoustic wave element on a substrate;
providing a terminal on the substrate so as to be electrically coupled to the acoustic wave element;
providing a first insulating layer on the substrate so that the acoustic wave element is exposed and a first opening of the first insulating layer is overlapped with at least a part of the terminal;
providing a second insulating layer on the substrate and the first insulating layer so that a cavity is formed above the acoustic wave element and a second opening of the second insulating layer is overlapped with at least a part of the first opening;
providing a third insulating layer on the second insulating layer so that a third opening of the third insulating layer includes the region where the first opening and the second opening are overlapped with each other;
providing a metal post in the first opening, the second opening and the third opening so as to be electrically coupled to the terminal; and
providing a solder ball on the metal post.
10 . The method as claimed in claim 9 , wherein in the step of providing the metal post, the metal post is formed so that height from the substrate to an upper face of the metal post is lower than a height from the substrate to an upper face of the third insulating layer.
11 . The method as claimed in claim 9 , wherein in the step of providing the metal post, the metal post is formed with a plating method.
12 . The method as claimed in claim 9 , wherein the cavity, the first opening, the second opening and the third opening are formed with photolithography method.
13 . The method as claimed in claim 9 , wherein in the step of providing the acoustic wave element, a surface acoustic wave element or a piezoelectric thin film resonator is provided.