Method of manufacturing semiconductor device and thermal annealing apparatus
A method of manufacturing a semiconductor device has forming a ferroelectric film over a substrate, placing the substrate having the ferroelectric film in a chamber substantially held in vacuum, introducing oxygen and an inert gas into the chamber, annealing the ferroelectric film in the chamber, and containing oxygen and the inert gas while the chamber is maintained sealed.
1. A method of manufacturing a semiconductor device, comprising:
forming a ferroelectric film over a substrate;
placing the substrate having the ferroelectric film in a chamber substantially held in vacuum;
introducing oxygen and an inert gas into the chamber;
sealing the chamber after introducing oxygen and the inert gas into the chamber; and
annealing the ferroelectric film in the chamber containing oxygen and the inert gas while the chamber is maintained sealed.
2. The method of manufacturing the semiconductor device according to claim 1 , wherein the introducing oxygen and the inert gas into the chamber is performed while a volume ratio of oxygen and the inert gas is controlled.
3. The method of manufacturing the semiconductor device according to claim 1 , wherein the introducing oxygen and the inert gas into the chamber introduces the oxygen and the inert gas having a volume ratio of oxygen and the inert gas ranging between 1:30 and 1:40.
4. The method of manufacturing the semiconductor device according to claim 1 , further comprising:
forming an lower electrode over the substrate before the forming the ferroelectric film over the substrate; and
forming an upper electrode over the substrate.
5. The method of manufacturing the semiconductor device according to claim 1 , wherein the introducing oxygen and the inert gas into the chamber is performed until a total pressure of a mixture of oxygen and the inert gas achieves 1 atmosphere or more.
6. The method of manufacturing the semiconductor device according to claim 1 , wherein the ferroelectric film is lead zirconium titanate.
7. The method of manufacturing the semiconductor device according to claim 1 , wherein the ferroelectric film is formed using at least one of a Physical Vapor Deposition method or a sol-gel method.
8. The method of manufacturing the semiconductor device according to claim 1 , wherein the ferroelectric film has a thickness in a range from 50 nm to 300 nm.
9. The method of manufacturing the semiconductor device according to claim 1 , wherein the inert gas is argon.