Thin film encapsulation for thin film batteries and other devices

1. An electrochemical device comprising:

an environmentally sensitive layer; and

a thin encapsulation layer deposited over said sensitive layer, comprising a plurality of alternating metallic sub-layers and ceramic sub-layers,

wherein at least one area of said thin encapsulation layer corresponding to the environmentally sensitive layer is selectively conductive and another area is insulating.

2. The electrochemical device of claim 1 wherein said metallic sub-layers comprise at least one element selected from the group comprising: scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, carbon, silicon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.

3. The electrochemical device of claim 1 wherein said ceramic sub-layers comprise nitrides of at least one element selected from the group comprising: scandium, yttrium, lanthanum, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, nickel, copper, zinc, boron, aluminum, carbon, silicon, germanium, beryllium, magnesium, calcium, strontium, barium, lithium, sodium, potassium, rubidium, and caesium.

4. The electrochemical device of claim 1 wherein said environmentally sensitive layer comprises at least one material selected from the group consisting of: lithium alloy, lithium solid solution, metallic lithium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, zirconium, niobium, molybdenum, palladium, silver, hafnium, tantalum, tungsten, iridium, platinum, gold, beryllium, magnesium, calcium, strontium, barium, boron, aluminum, indium, carbon, silicon, germanium, tin, lead, phosphorus, arsenic, antimony, and bismuth.

5. The electrochemical device of claim 1 further comprising a stress modulation layer disposed between said environmentally sensitive layer and said encapsulation layer.

6. The electrochemical device of claim 5 wherein said stress modulation layer is not reactive with either said environmentally sensitive layer or said thin encapsulation layer.

7. The electrochemical device of claim 5 where said stress modulation layer comprises Lipon.

8. The electrochemical device of claim 1 where said environmentally sensitive layer is soft.

9. The electrochemical device of claim 8 wherein said soft, environmentally sensitive layer comprises of at least one material selected from the group consisting of: lithium alloy, lithium solid solution, and metallic lithium.

10. The electrochemical device of claim 1 wherein at least one sub-layer of said encapsulation layer is deposited using sputtering from a metallic target.

11. The electrochemical device of claim 1 wherein at least one sub-layer of said encapsulation layer is deposited using a dual sputter cathode deposition method.

12. The electrochemical device of claim 1 wherein said environmentally sensitive material comprises an anode.

13. The electrochemical device of claim 1 wherein said device maintains thermal stability under solder reflow conditions of up to 265° C.

14. The electrochemical device of claim 1 wherein said at least one area of selectively conductive thin encapsulation layer serves as one electrical terminal of said device.

15. The electrochemical device of claim 1 wherein said encapsulation layer is flexible.

16. The electrochemical device of claim 1 further comprising:

a cathode;

an electrolyte deposited on said cathode;

an anode deposited on said electrolyte;

a stress modulating layer deposited between said anode and said encapsulation layer.

17. The electrochemical device of claim 16 wherein said cathode comprises LiCoO 2 .

18. The electrochemical device of claim 16 wherein said electrolyte comprises Lipon.

19. The electrochemical device of claim 16 wherein said anode comprises at least one material selected from the group consisting of: lithium alloy, lithium solid solution, and metallic lithium.

20. The electrochemical device of claim 16 wherein said stress modulating material comprises Lipon.

21. The electrochemical device of claim 16 wherein said cathode thickness is between about 0.5 μm and 200 μm.

22. The electrochemical device of claim 16 wherein said electrolyte thickness is less than about 5 μm.

23. The electrochemical device of claim 16 wherein said anode thickness is between about 0.1 μm and 30 μm.

24. The electrochemical device of claim 1 wherein said alternating metallic and blocking layers comprise at least two metallic sub-layers and at least two ceramic sub-layers, respectively.

25. The electrochemical device of claim 24 wherein the total thickness of every metallic layer and every ceramic layer is less than about 5 μm.

26. An electrochemical device comprising:

a cathode;

an electrolyte deposited on said cathode;

a soft, environmentally sensitive anode deposited on said electrolyte;

a stress modulating layer deposited on said anode; and

an encapsulation layer, comprising a plurality of alternating metallic and ceramic sub-layers, deposited on said modulating layer,

wherein at least one area of said encapsulation layer corresponding to the anode is selectively conductive and another area is insulating.

27. An electrochemical device comprising:

a cathode greater than about 0.5 μm and less than about 200 μm thick;

an electrolyte less than about 5 μm thick;

an anode greater than about 0.1 μm and less than about 30 μm thick;

a modulating layer;

a plurality of alternating metallic and ceramic sub-layers, wherein each sub-layer is less than about 5 μm thick; and

wherein at least one area of said plurality of alternating metallic and ceramic sub-layers corresponding to the anode is selectively conductive and another area is insulating.