Liquid cooling systems for server applications
View Patent ↗Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and/or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact.
1. A thermal interface system between an electronic component and an electronic component chassis, the system comprising:
a first heat exchanger associated with the electronic component, wherein the electronic component is a microprocessor, an integrated circuit, an electronic server, a rack server, or a blade server having one or more heat generating objects;
a second heat exchanger associated with the chassis and aligned to interface with the first heat exchanger when the electronic component is housed in the chassis; and
a thermal contact mechanism that selectively applies pressure between the first and second heat exchangers to engage the first and second heat exchangers in thermal communication, and wherein the mechanism isolates the pressure applied between the first and second heat exchangers from the electronic component;
wherein the electronic component is configured to be inserted into the chassis along an insertion vector, and wherein the interface between the first and second heat exchangers is substantially parallel to the insertion vector; and
wherein the pressure applied between the first and second heat exchangers is applied substantially perpendicular to the insertion vector.
2. The system of claim 1 , wherein the electronic component further comprises a liquid-based cooling system comprising a cold plate configured to transfer heat from one or more of the heat generating objects to the liquid and wherein the first heat exchanger comprises a rejector plate heat exchanger.
3. The system of claim 2 , wherein the first heat exchanger is a cylindrical heat exchanger and wherein the second heat exchanger is an annular heat exchanger configured to receive the first heat exchanger.
4. The system of claim 2 , wherein the second heat exchanger is a cylindrical heat exchanger and wherein the first heat exchanger is an annular heat exchanger configured to receive the second heat exchanger.
5. The system of claim 3 , wherein the thermal contact mechanism is an expandable bladder associated with the cylindrical heat exchanger.
6. The system of claim 4 , wherein the thermal contact mechanism is an expandable bladder associated with the cylindrical heat exchanger.
7. The system of claim 1 , further comprising a thermal interface material between interfacing surfaces of the first and second heat exchangers.
8. The system of claim 7 , wherein the thermal interface material is thermal grease or a thermal pad.
9. The system of claim 1 , wherein the second heat exchanger is thermally coupled to an external heat exchanger.
10. The system of claim 1 , wherein the thermal contact mechanism is selected from the group consisting of: a mechanical clamp; a spring; a hydraulic motor, a pneumatic motor; an electromechanical motor; a hydraulic actuator, a pneumatic actuator; an electromechanical actuator and any combination of the foregoing.
11. The system of claim 1 , wherein the thermal contact mechanism is an expandable bellows or bladder.
12. The system of claim 1 , wherein the interface surfaces of the first and second heat exchangers are smooth.
13. The system of claim 1 , wherein the interface surfaces of the first and second heat exchangers are textured.
14. The system of claim 1 , wherein the thermal contact mechanism is activated when the electronic component is locked into the chassis.
15. The system of claim 1 , wherein the thermal contact mechanism is configured to create an engagement pressure between the first and second heat exchanger of up to about 30 psi.
16. The system of claim 1 , wherein the thermal contact mechanism is configured to create an engagement pressure between the first and second heat exchanger of more than about 30 psi.
17. A system for transferring heat from a plurality of heat producing electronic components housed in a chassis, the system comprising:
a chassis configured to accept and selectively electronically couple the plurality of electronic components, and comprising a chassis closed loop cooling system having one or more cold plate chassis heat exchangers configured to transfer heat from an associated electronic component;
a plurality of electronic components having one or more heat generating objects, each electronic component configured to be inserted into the chassis along a chassis insertion vector, each electronic component comprising a component closed loop cooling system including a rejecting plate heat exchanger configured to interface with and thermally communicate with an associated chassis heat exchanger when the electronic component is housed within the chassis;
a thermal interface material disposed at an interface between the rejecting plate heat exchanger and the associated chassis heat exchanger; and
a contact mechanism that selectively applies force to at least one of the rejecting plate heat exchanger and the associated chassis heat exchanger to contact the rejecting plate heat exchanger and the associated chassis heat exchanger across the thermal interface material thereby placing the rejecting plate heat exchanger and the associated chassis heat exchanger in thermal communication and wherein the contact mechanism isolates the force applied to the at least one rejecting plate heat exchanger and the associated chassis heat exchanger from the electronic component;
wherein the force applied to the at least one reflecting plate heat exchanger and the associated chassis heat exchanger is applied substantially perpendicular to the insertion vector.
18. The system of claim 17 , wherein the electronic component is a microprocessor, an integrated circuit, an electronic server, a rack server, or a blade server.
19. The system of claim 18 , wherein the rejecting plate heat exchanger is a cylindrical heat exchanger and wherein the associated chassis heat exchanger is an annular heat exchanger configured to receive the rejecting plate heat exchanger.
20. The system of claim 18 , wherein the associated chassis heat exchanger is a cylindrical heat exchanger and wherein the rejecting plate heat exchanger is an annular heat exchanger configured to receive the chassis heat exchanger.
21. The system of claim 19 , wherein the contact mechanism is an expandable bladder associated with the cylindrical heat exchanger.
22. The system of claim 20 , wherein the contact mechanism is an expandable bladder associated with the cylindrical heat exchanger.
23. The system of claim 17 , wherein the thermal interface material is thermal grease or a thermal pad.
24. The system of claim 17 , wherein chassis heat exchanger is thermally coupled to an external heat exchanger.
25. The system of claim 17 , wherein the interface between the rejecting plate heat exchanger and the associated chassis heat exchanger is substantially parallel to the insertion vector.
26. The system of claim 17 , wherein the contact mechanism is selected from the group consisting of: a mechanical clamp; a spring; a hydraulic motor, a pneumatic motor; an electromechanical motor; a hydraulic actuator, a pneumatic actuator; an electromechanical actuator and any combination of the foregoing.
27. The system of claim 17 , wherein the contact mechanism is an expandable bellows or bladder.
28. The system of claim 17 , wherein the interface surfaces of the heat exchangers are smooth.
29. The system of claim 17 , wherein the interface surfaces of the heat exchangers are textured.
30. The system of claim 17 , wherein the contact mechanism is activated when the electronic component is locked into the chassis.
31. The system of claim 17 , wherein the contact mechanism is configured to create up to about 30 psi.
32. The system of claim 17 , wherein the contact mechanism is configured to create more than 30 psi.
33. A method of transferring heat from an electronic component housed in a chassis, the method comprising:
providing a chassis that operatively houses one or more electronic components;
inserting an electronic component into the chassis along an insertion vector, the electronic component comprising one or more heat generating objects and a cooling system having a first heat exchanger;
providing a second heat exchanger associated with the chassis and aligned to interface with the first heat exchanger when the electronic component is housed in the chassis;
activating a contact mechanism that forces the first and second heat exchangers into thermal communication such that a force between the first and second heat exchangers is applied substantially perpendicular to the insertion vector and is isolated from the electronic component; and
transferring heat from the electronic component to the second heat exchanger.
34. The method of claim 33 , further comprising transferring heat from the second heat exchanger to another heat exchanger that is external to the chassis.
35. The method of claim 33 , further comprising providing a thermal interface material at an interface between the first and second heat exchanger.