Module with Flat Construction and Method for Placing Components
A module for electrical components is proposed in which connection surfaces that can be bonded are provided on a multi-layer substrate with integrated wiring; a component chip is bonded on the top that has bond pads on its surface pointing upward and that contacts the substrate by means of bonding wires. Here, the wire guide of the bonding wires is so that they are each bonded with a ball on a connection surface and with the wedge directly on one of the bond pads.
1 . A module for electrical components, the module comprising:
a multi-layer substrate, including wiring integrated with the substrate and connection areas at a top surface of the substrate;
a component chip bonded to the top surface of the substrate, the component chip having bond pads at a surface pointing upward;
bond wires connecting the bond pads of the component chip to respective connection areas of the substrate, wherein the bond wires are each bonded with a ball on a connection area and with a wedge directly on one of the bond pads.
2 . The module according to claim 1 , wherein the bond wires are formed as flat loops following the surface of the component chip.
3 . The module according to claim 2 , further comprising a glob top covering the top surface of the substrate up to and past the height of the loops of the bond wires.
4 . The module according to claim 1 , wherein a stitch is bonded on a wedge-bonded wire end and the bond pad.
5 . The module according to claim 1 , wherein each bond pad comprises:
a ground metallization over the component chip;
a passivation layer, wherein the component chip and lateral edges of the bond pads are covered with the passivation layer; and
a reinforcement layer over the ground metallization and covering a joint between the passivation layer and ground metallization.
6 . The module according to claim 5 , wherein the reinforcement layer projects past the passivation layer in a direction away from the component chip.
7 . The module according to claim 5 , wherein the reinforcement layer overlaps lateral edges of the passivation layer.
8 . The module according to claim 1 , wherein the component chip has a thickness not greater than 200 μm.
9 . The module according to claim 5 , wherein the reinforcement layer comprises a Cu layer and an Au layer.
10 . The module according to claim 1 , further comprising a resistor on the substrate, the resistor comprising a printed strip conductor made from a resistive paste.
11 . The module according to claim 1 , wherein the substrate comprises an FR4 material.
12 . The module according to claim 1 , wherein the substrate comprises an LTTC ceramic.
13 . The module according to claim 1 , wherein the bond wires comprise metallic ribbons.
14 . A method for assembling a module, the method comprising:
providing a substrate with connection surfaces and a component chip with bond pads;
attaching the component chip to the substrate;
bonding a bonding wire with a ball on one of the connection surfaces; and
bonding an opposite end of the bonding wire with a wedge directly on the bond pad.
15 . The method according to claim 14 , further comprising bonding a stud bump above the bonded wedge.
16 . The method according to claim 14 , wherein the bonding wire is shaped into a flat loop that follows a surface of the component chip while located above the surface and is first bent downward toward the substrate next to the component chip.
17 . The method according to claim 14 , further comprising depositing a glob top mass or mold mass up to a height such that the bonding wire is completely covered.
18 . The method according to claim 14 , wherein each bond pad comprises:
a ground metallization over the component chip;
a passivation layer, wherein the component chip and lateral edges of the bond pads are covered with the passivation layer; and
a reinforcement layer over the ground metallization and covering a joint between the passivation layer and ground metallization.