Electrical module with specified ground-side connection of filter circuit shunt arms

1. An electrical module comprising:

a first substrate;

a component mounted on the first substrate, the component comprising a second substrate and a chip arranged on the second substrate;

a filter circuit arranged on the chip, the filter circuit comprising shunt arms coupled to ground, each shunt arm with at least one parallel resonator,

wherein ground-side connections of at least two of the shunt arms to each other is realized outside the chip and the second substrate,

wherein the component has a shielding surface, and

wherein a ground connection of the shielding surface is not realized in the second substrate, but instead in the first substrate.

2. The module according to claim 1 ,

wherein the shielding surface is electrically connected to one of the parallel resonators of the filter circuit by means of an electrical connection arranged in the first substrate, and

wherein the electrical connection is electrically connected to a ground surface that is arranged in the first substrate and to which the at least two shunt arms of the filter circuit are connected.

3. The module according to claim 1 ,

wherein one of the parallel resonators of the filter circuit is electrically connected to the shielding surface by means of an electrical connection arranged on the chip or in the second substrate, and

wherein the shielding surface is electrically connected by means of another electrical connection to a ground surface that is arranged in the first substrate and to which the at least two shunt arms of the filter circuit are connected.

4. An electrical module comprising:

a first substrate;

a component mounted on the first substrate, the component comprising a second substrate and a chip arranged on the second substrate;

a filter circuit arranged on the chip, the filter circuit comprising shunt arms coupled to ground, each shunt arm with at least one parallel resonator,

wherein ground-side connections of at least two of the shunt arms to each other is realized outside the chip and the second substrate, and

wherein the ground-side connection of at least two of the shunt arms is realized on a circuit board on which the first substrate is mounted.

5. The module according to claim 4 , wherein a ground-side connection of another at least two of the shunt arms is realized in the first substrate.

6. The module according to claim 4 , wherein the filter circuit comprises a duplexer that has a transmission filter and a reception filter, and

wherein the at least two shunt arms connected to each other on a ground side outside the chip and the second substrate are part of the transmission filter or the reception filter.

7. The module according to claim 6 ,

wherein the duplexer comprises an antenna connection coupled to ground by means of a first electrical connection arranged partially in the second substrate, and

wherein a ground connection of the first electrical connection is not realized in the second substrate, but instead in the first substrate.

8. The module according to claim 7 , wherein the first electrical connection comprises an inductor.

9. The module according to claim 4 ,

wherein the filter circuit comprises a duplexer that has a transmission filter and a reception filter, and

wherein of the at least two shunt arms connected to each other on the ground side outside the chip and the second substrate, at least one arm belongs to a transmission filter and at least one other arm belongs to a reception filter of the duplexer.

10. The module according to claim 9 ,

wherein the duplexer comprises an antenna connection coupled to ground by means of a first electrical connection arranged partially in the second substrate, and

wherein a ground connection of the first electrical connection is not realized in the second substrate, but instead in the first substrate.

11. The module according to claim 10 , wherein the first electrical connection comprises an inductor.

12. The module according to claim 4 ,

wherein the component has a shielding surface, and

wherein a ground connection of the shielding surface is not realized in the second substrate, but instead in the first substrate.

13. The module according to claim 4 , wherein there is no ground-side connection of shunt arms within the second substrate.

14. The module according to claim 4 ,

wherein at least one electrical connection arranged in the first and/or second substrate comprises at least one strip conductor that has at least one partial winding or is folded.

15. The module according to claim 4 , wherein the other at least two shunt arms are electrically coupled to a ground surface arranged in the first substrate by means of electrical connections that are arranged partially in the second substrate.

16. The module according to claim 15 , further comprising at least one other electrical component with ground connections coupled to the ground surface, the at least one other electrical component being arranged on the first substrate.

17. The module according to claim 16 , wherein, in the first substrate, at least one circuit is integrated that is electrically connected to the component.

18. An electrical module comprising:

a first substrate;

a component mounted on the first substrate, the component comprising a second substrate and a chip arranged on the second substrate;

a filter circuit arranged on the chip, the filter circuit comprising shunt arms coupled to ground, each shunt arm with at least one parallel resonator;

wherein ground-side connections of at least two of the shunt arms to each other is realized outside the chip and the second substrate, and

wherein the at least two shunt arms are electrically coupled to a ground surface arranged in the first substrate by means of electrical connections that are arranged partially in the second substrate,

at least one other electrical component with ground connections coupled to the ground surface, the at least one other electrical component being arranged on the first substrate.

19. The module according to claim 18 , wherein, in the first substrate, at least one circuit is integrated that is electrically connected to the component.