IP Library Granted Patent US 8,067,745
Granted Patent B2
US 8,067,745 · App. 12/354,135 · Granted Nov 29, 2011

X-ray detector and manufacturing method thereof

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Quick Facts
Patent No.
US 8,067,745
App. No.
12/354,135
Granted
Nov 29, 2011
Kind
B2
Abstract

An X-ray detector includes; a panel having a plurality of photo-detecting pixels generating electrical signals in response to the detection of X-rays, a gate driver providing a gate signal to the plurality of photo-detecting pixels, wherein the photo-detecting pixels output the electrical signals in response to the gate signal, a readout integrated circuit reading out the electrical signal in response to the gate signal, a main board including a controller receiving the electrical signal and converting the electrical signal to an image signal, a film attached to the panel and the main board, the film including a signal line electrically connecting the readout integrated circuit to the panel and main board, wherein the readout integrated circuit is mounted on the film, and a shielding layer covering the film and comprising a conductive material, wherein the shielding layer prevents externally applied electromagnetic signals from passing through the film.

Claims (53)

1. An X-ray detector comprising:

a panel comprising a plurality of photo-detecting pixels configured to generate electrical signal in response to the detection of X-rays;

a gate driver configured to provide a gate signal to the plurality of photo-detecting pixels, wherein the photo-detecting pixels output the electrical signal in response to the gate signal;

a readout integrated circuit configured to read out the electrical signal output from the photo-detecting pixels in response to the gate signal;

a main board including a controller configured to convert an output from the readout integrated circuit to an image signal;

a film attached to the panel and the main board, the film including a signal line electrically connecting the readout integrated circuit to the panel and the main board, wherein the readout integrated circuit is mounted on the film; and

a shielding layer covering the film and comprising a conductive material.

2. The X-ray detector as claimed in claim 1 , wherein the shielding layer receives a ground voltage.

3. The X-ray detector as claimed in claim 2 , wherein the shielding layer comprises a copper thin film.

4. The X-ray detector as claimed in claim 1 , wherein the film comprises:

a first insulating layer on which the signal line is provided; and

a second insulating layer covering the signal line on the first insulating layer.

5. The X-ray detector as claimed in claim 4 , wherein the shielding layer covers outer surfaces of the first and second insulating layers.

6. The X-ray detector as claimed in claim 4 , wherein the film comprises:

a first ground interconnection disposed on an outer surface of the first insulating layer;

a third insulating layer covering the first ground interconnection;

a second ground interconnection disposed on an outer surface of the second insulating layer; and

a fourth insulating layer covering the second ground interconnection.

7. The X-ray detector as claimed in claim 6 , wherein the shielding layer covers outer surfaces of the third and fourth insulating layers.

8. The X-ray detector as claimed in claim 1 , further comprising a scintillator disposed on the panel and configured to convert the X-rays into a light having a wavelength band detectable by the photo-detecting pixels.

9. The X-ray detector as claimed in claim 8 , wherein each of the photo-detecting pixels comprises;

a photodiode configured to detect the light output from the scintillator and output the electrical signal corresponding to the detected light; and

a switching device configured to control the passage of the electrical signal from the photodiode through an input electrode and out an output electrode.

10. The X-ray detector as claimed in claim 9 , wherein the switching device comprises a transistor, and the panel further comprises:

a gate line connected to a control electrode of the transistor and configured to receive the gate signal from the gate driver; and

a data line connected to an output electrode of the transistor and configured to provide the electrical signal to the readout integrated circuit.

11. A method of manufacturing an X-ray detector including a scintillator configured to convert X-rays into a light having a predetermined wavelength band, a panel provided with photo-detecting pixels that detect the light by converting the light into an electrical signal, a readout integrated circuit that reads out the electrical signal output from the photo-detecting pixels, and a main board provided with a controller that converts an output from the readout integrated circuit to an image signal, the method comprising:

providing a film;

mounting the readout integrated circuit on the film;

attaching the film to the panel and the main board to electrically connect the readout integrated circuit to the panel and the main board; and

disposing a shielding layer comprising a conductive material on the film, wherein the shielding layer is configured to protect signals passing through the film from external electronic interference.

12. The method as claimed in claim 11 , wherein the shielding layer comprises a copper thin film.

13. The method as claimed in claim 12 , wherein the providing of the film comprises:

disposing a first insulating layer at an upper surface of a signal line, wherein the signal line is configured to transmit the electrical signal; and

disposing a second insulating layer on a lower surface of the signal line to cover the signal line.

14. The method as claimed in claim 13 , wherein the shielding layer covers outer surfaces of the first and second insulating layers.

15. The method as claimed in claim 13 , further comprising:

disposing a first ground interconnection on an outer surface of the first insulating layer;

disposing a third insulating layer covering the first ground interconnection;

disposing a second ground interconnection on an outer surface of the second insulating layer; and

disposing a fourth insulating layer covering the second ground interconnection.

16. The method as claimed in claim 15 , wherein the shielding layer covers outer surfaces of the third and fourth insulating layers.

17. An X-ray system comprising:

an X-ray generator configured to generate X-rays;

a scintillator configured to convert X-rays from the X-ray generator into a light having a predetermined wavelength band;

a panel comprising a plurality of photo-detecting pixels configured to generate electrical signal in response to the detection of the light;

a gate driver configured to provide a gate signal to the plurality of photo-detecting pixels, wherein the photo-detecting pixels output the electrical signal in response to the gate signal;

a readout integrated circuit configured to read out the electrical signal output from the photo-detecting pixels in response to the gate signal;

a main board including a controller configured to convert an output from the readout integrated circuit to an image signal;

a film attached to the panel and the main board, the film including a signal line electrically connecting the readout integrated circuit to the panel and the main board, wherein the readout integrated circuit is mounted on the film;

a shielding layer covering the film and comprising a conductive material;

a display apparatus connected to the main board and configured to display an image corresponding to an image signal supplied from the main board.

18. The X-ray system as claimed in claim 17 , wherein the shielding layer is configured to prevent externally applied electromagnetic signals from passing through the film.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029093/0177 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2009
From: JUNG, KWAN-WOOK; GOO, KYUNG-SANG; CHOO, DAE-HO
To: SAMSUNG ELECTRONICS CO., LTD
Reel/Frame 022112/0446 →