Organic light-emitting diode display device and method of manufacturing the same

1. A method of manufacturing an organic light-emitting diode display device, the method comprising:

forming an organic light-emitting substrate part, the forming the organic light-emitting substrate part comprising:

forming a base substrate; and

forming an organic light-emitting diode display portion on the base substrate to display an image thereon; and

forming a protective cover part comprising a first frit glass disposed on the organic light-emitting diode display portion to cover the organic light-emitting diode display portion and a second frit glass formed around a periphery of the first frit glass and connected to the first frit glass,

wherein forming the protective cover part comprises:

forming the first frit glass on a cover substrate;

forming the second frit glass on a cover substrate;

connecting the cover substrate to the organic light-emitting substrate part; and

separating the cover substrate from the first frit glass and the second frit glass.

2. The method of claim 1 , wherein the forming the first frit glass and the forming the second frit glass each comprises:

forming a first frit paste on the cover substrate;

forming a second frit paste on the cover substrate around a periphery of the organic light-emitting diode display portion defined by the first frit paste;

drying the first frit paste and the second frit paste; and

firing the first frit paste and the second frit paste to form the first frit glass and the second frit glass, respectively.

3. The method of claim 2 , wherein the forming the first frit glass and the forming the second frit glass further comprises partially curing the second frit glass and completely curing the first frit glass by:

applying a laser beam to a boundary area between the first frit glass and the second frit glass, the boundary area including only a portion of the second frit glass such that only the portion of the second frit glass included in the boundary area is cured, and

applying the laser beam to an entire area of the first frit glass to cure the entire area of the first frit glass.

4. The method of claim 2 , wherein the first frit paste and the second frit paste each comprises:

frit powder particles;

binder particles interposed between the frit powder particles; and

filler particles interposed between the frit powder particles, wherein the forming the first frit glass and the forming the second frit glass each further comprises dissolving the frit powder particles, the binder particles and the filler particles using a solvent.

5. The method of claim 4 , wherein the drying the first frit paste and the second frit paste and the firing the first frit paste and the second frit paste each comprises:

drying the first frit paste and the second frit paste at a first temperature to remove the solvent therefrom; and

firing the first frit paste and the second frit paste, from which the solvent is removed, at a second temperature greater than the first temperature, to remove the binder particles from the first frit paste and the second frit paste.

6. The method of claim 5 , wherein

the first temperature has a range of approximately 180° C. to approximately 220° C., and

the second temperature has a range of approximately 400° C. to approximately 600° C.

7. The method of claim 1 , wherein the connecting the cover substrate to the organic light-emitting substrate part comprises:

aligning the cover substrate with the organic light-emitting substrate part such that the first frit glass covers the organic light-emitting diode display portion; and

applying a laser beam to the second frit glass to connect the second frit glass to the base substrate.

8. The method of claim 1 , wherein the forming the protective cover part further comprises:

forming a frit cover layer between the cover substrate and each of the first frit glass and the second frit glass.

9. The method of claim 8 , wherein forming the protective cover part further comprises, prior to separating the cover substrate from the first and second frit glasses, irradiating a laser beam onto an entire area of the frit cover layer.

10. The method of claim 9 , wherein the frit cover layer includes a single layer comprising one of an inorganic insulation layer and a metal layer.

11. The method of claim 9 , wherein the frit cover layer includes a double layer comprising an inorganic insulation layer and a metal layer.

12. The method of claim 11 , wherein

the metal layer is formed on the cover substrate, and

the inorganic insulation layer is formed between the metal layer and each of the first frit glass and the second frit glass.

13. The method of claim 1 , wherein a thickness of the second frit glass is greater than a corresponding thickness of the first frit glass.