Semiconductor device
View Patent ↗Provided is a semiconductor device, in which: patterns for detecting displacement at probing are formed of a plurality of minute conductors formed below a protective film; each of the plurality of minute conductors formed below the protective film is electrically insulated and formed to be smaller than a bottom surface of a tip of a probing needle used for carrying out an electrical measurement of IC chips; and the patterns for detecting displacement at probing are provided in a pair for each of the IC chips.
1. A semiconductor IC array comprising:
semiconductor ICs arranged in an array, each being to be tested with a plurality of probe needles:
at least one group of metal marks electrically isolated from the probe needles and arranged in a pattern to cooperate with at least one of the probe needles to detect appropriate displacement in probing for the semiconductor ICs,
wherein the metal marks are electrically isolated from one another and each have a probed surface smaller than a tip surface of a probe needle; and
an electrically insulating film which covers the at least one group of metal marks to electrically isolate the at least one group of metal marks from the probe needles and holds capacitances between the metal marks and the at least one of the probe needles placed on the film, wherein the capacitances are a function of relative distances between the metal marks and the at least one of the probe needles placed on the film.
2. A semiconductor IC array according to claim 1 , wherein the metal marks are made of aluminum.
3. A semiconductor IC array according to claim 1 , wherein the electrically insulating film is made of silicon nitride.
4. A semiconductor IC array according to claim 1 , wherein the semiconductor ICs are on a silicon wafer.
5. A semiconductor IC array according to claim 1 , wherein the at least one group of metal marks is placed between the semiconductor ICs.
6. A semiconductor IC array according to claim 1 , wherein the at least one group of metal marks is placed in the semiconductor ICs.