Electronic apparatus
View Patent ↗According to one aspect of the invention, there is provided an electronic apparatus having a circuit board supporting structure, the circuit board supporting structure including: a casing including a first body and a second body, the first body having a first boss portion, the second body having a second boss portion; a jig including a cylindrical portion having, and a flange portion formed on an outer periphery, the cylindrical portion configured to slidably receive the first boss portion and the second boss portion in an inner peripheral wall; and a circuit board disposed in the casing. The first and second boss portions are configured to be fastened by a bolt member; the circuit board has a hole and a joining region provided around the hole, the hole configured to allow the cylindrical portion to penetrate therethrough; and the joining region is configured to be soldered to the flange portion.
1. An electronic apparatus having a circuit board supporting structure, the circuit board supporting structure comprising:
a casing including a first body and a second body, the first body having a first boss portion, the second body having a second boss portion;
a jig including a cylindrical portion having an inner peripheral wall, and a flange portion formed on an outer periphery, the cylindrical portion configured to slidably receive the first boss portion and the second boss portion in the inner peripheral wall; and
a circuit board disposed in the casing, wherein:
the first boss portion and the second boss portion are configured to be fastened by a bolt member;
the circuit board has a hole and a joining region provided around the hole, the hole configured to allow the cylindrical portion to penetrate therethrough; and
the joining region is configured to be soldered to the flange portion.
2. The apparatus of claim 1 ,
wherein the second boss portion has a rib formed on an outer periphery thereof, and
the rib is configured to be slidable on the inner peripheral wall.
3. The apparatus of claim 1 ,
wherein a gap between the first body and the second body is larger than a length of the cylindrical portion.
4. The apparatus of claim 1 ,
wherein the cylindrical portion has a cutout portion in a longitudinal direction of the cylindrical portion.
5. An electronic apparatus having a circuit board supporting structure, the circuit board supporting structure comprising:
a casing including a first body and a second body, the first body having a first boss portion, the second body having a second boss portion;
a bolt member configured to fasten the first and second boss portions;
a jig including a cylindrical portion having an inner peripheral wall, and a flange portion formed on an outer periphery, the cylindrical portion configured to slidably receive the first boss portion and the second boss portion in the inner peripheral wall; and
a circuit board disposed in the casing, wherein:
the circuit board has a hole and a joining region provided around the hole, the hole configured to allow the cylindrical portion to penetrate therethrough; and
the joining region is configured to be soldered to the flange portion.
6. The apparatus of claim 1 , wherein the circuit board supporting structure further comprises:
a first wiring formed on the circuit board;
a second wiring formed on the circuit board; and
a circuit network, wherein:
the joining region includes a first solder joint and a second solder joint separated from the first solder joint, the first solder joint configured to electrically connect with the first wiring, the second solder joint configured to electrically connect with the second wiring;
the jig has a conductive portion configured to electrically connect the first solder joint and the second solder joint; and
the circuit network electrically connects with the first wiring and the second wiring to measure an electrical characteristic value of the first solder joint or the second solder joint.
7. The apparatus of claim 5 , wherein the circuit board supporting structure further comprises:
a first wiring formed on the circuit board;
a second wiring formed on the circuit board; and
a circuit network, wherein:
the joining region includes a first solder joint and a second solder joint separated from the first solder joint, the first solder joint configured to electrically connect with the first wiring, the second solder joint configured to electrically connect with the second wiring;
the jig has a conductive portion configured to electrically connect the first solder joint and the second solder joint; and
the circuit network electrically connects with the first wiring and the second wiring to measure an electrical characteristic value of the first solder joint or the second solder joint.
8. The apparatus of claim 6 ,
wherein the electrical characteristic value includes at least one of a resistance value, a voltage value, and a current value.
9. The apparatus of claim 7 ,
wherein the electrical characteristic value includes at least one of a resistance value, a voltage value, and a current value.