Low profile stacking system and method
View Patent ↗The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a packaged integrated circuit device are substantially exposed. A solder paste that includes higher temperature solder paste alloy is applied to a substrate or to the integrated circuit device to be mounted. The integrated circuit device is positioned to contact the contacts of the substrate. Heat is applied to create high temperature joints between the contacts of the substrate and the integrated circuit device resulting in a device-substrate assembly with high temperature joints. The formed joints are less subject to re-melting in subsequent processing steps. The method may be employed in devising stacked module constructions such as those disclosed herein as preferred embodiments in accordance with the invention. Typically, the created joints are low in profile.
1. A method of devising a stacked circuit module, comprising:
disposing a first integrated circuit beneath a second integrated circuit;
connecting the first and second integrated circuits using a flex circuit; and
joining each of the first integrated circuit and the second integrated circuit to the flex circuit through a high temperature joint comprising an alloy, the alloy having a proportion of no more than 95% tin and at least 5% antimony, and having a melting point between 235° C. to 260° C.,
wherein the flex circuit comprises first and second outer layers, first and second conductive layers, between which there is an intermediate layer, the first and second conductive layers and the intermediate layer being interior to the first and second outer layers, the second conductive layer having demarked first and second flex contacts, the first flex contacts being accessible through first windows through the second outer layer and the second flex contacts being accessible through second windows through the first outer layer, the first conductive layer, and the intermediate layer.
2. The method of claim 1 , further comprising providing module windows through the second outer layer, the second flex contacts being accessible through the module windows.
3. The method of claim 1 , in which the first and second conductive layers are metal.
4. The method of claim 1 , further comprising connecting selected ones of the first flex contacts to the first conductive layer.
5. The method of claim 1 , further comprising connecting selected ones of the first flex contacts and selected ones of the second flex contacts to the first conductive layer with vias.
6. The method of claim 1 , further comprising connecting selected ones of the first flex contacts to selected ones of the second flex contacts.
7. The method of claim 6 in which the connected selected ones of the first and second flex contacts arc connected with traces.