Package for a semiconductor light emitting device
View Patent ↗A semiconductor light emitting device package includes a substrate with a core and a copper layer overlying the core. The light emitting device is connected to the substrate directly or indirectly through a wiring substrate. The core of the substrate may be, for example, ceramic, Al 2 O 3 , AlN, alumina, silicon nitride, or a printed circuit board. The copper layer may be bonded to the core by a process such as direct bonding of copper or active metal brazing.
1. A method of packaging a semiconductor light emitting device, the method comprising:
providing a substrate having a thermal conductivity of at least 24 W/m·K, the substrate comprising a ceramic core and at least one copper layer, the at least one copper layer having a thickness of at least 4 mils; and
electrically connecting a semiconductor light emitting device to at least one of the copper layers.
2. The method of claim 1 further comprising attaching at least one lead to the at least one copper layer.
3. The method of claim 1 wherein the substrate is a first substrate, the method further comprising:
mounting the semiconductor light emitting device on a second substrate; and
after mounting the semiconductor light emitting device on the second substrate, mounting the second substrate on the first substrate.
4. The method of claim 1 further comprising:
providing a lens over the semiconductor light emitting device.
5. The method of claim 1 further comprising bonding the copper layer to the core by:
forming an oxide coating on a sheet of copper;
placing the oxide coating adjacent to the core; and
heating the oxide coating to form a eutectic melt.
6. The method of claim 1 further comprising connecting the substrate to a base.
7. The method of claim 6 further comprising attaching the base to a heat sink.
8. The method of claim 7 further comprising disposing a material between the heat sink and the base.
9. The method of claim 8 wherein the material is one of grease, phase change tape, solder, and a thermal blanket.
10. The method of claim 1 further comprising attaching a device comprising electrostatic discharge protection circuitry to the substrate.
11. The method of claim 3 further comprising attaching a device comprising electrostatic discharge protection circuitry to the second substrate.