A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode.
1. A light emitter comprising:
a substrate having a substrate surface and at least one side surface;
a light emitting diode (LED) located on the substrate surface;
an encapsulant encapsulating the light emitting diode;
a recess portion of the substrate surface, wherein the recess portion is configured to accommodate the light emitting diode and the encapsulant such that the encapsulant encloses the light emitting diode within the recess portion; and
a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface such that the substrate surface and all of the at least one side surface are enclosed by and in contact with the reflector cup.
2. The light emitter of claim 1 , wherein the substrate is comprised of at least one ceramic material.
3. The light emitter of claim 1 , wherein the hole in the reflector cup first side encompasses the recessed portion.
4. The light emitter of claim 1 , wherein the hole is conical shaped and wherein the hole in the reflector cup first side is smaller than the hole on the reflector cup second side.
5. The light emitter of claim 1 , wherein the reflector cup first side has an alignment structure having first and second surfaces formed therein, and wherein the alignment structure is configured to receive the substrate such that the substrate is encompassed within the alignment structure, with the first surface of the alignment structure approximating the substrate surface and the second surface of the alignment structure approximating the at least one side surface of the substrate.
6. The light emitter of claim 5 , wherein when the substrate is received within alignment structure, the LED is located in a predetermined position relative to the reflector cup.
7. The light emitter of claim 1 , wherein the reflector cup is mounted in a predetermined position relative to the LED.
8. A method of manufacturing a light emitter, the method comprising:
providing a substrate having a substrate surface, at least one side surface and electrical connections, wherein the substrate comprises a recess portion;
connecting a light emitting diode to the electrical connections;
encapsulating the light emitting diode with an encapsulant such that the encapsulant is within the recess portion;
testing the light emitting diode; and
connecting a reflector cup to the substrate surface if the result of the testing indicates that the light emitting diode is functional, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface such that the substrate surface and all of the at least one side surface are enclosed by and in contact with the reflector cup.
9. The method of claim 8 , wherein the connecting a light emitting diode to the electrical connections comprises locating the light emitting diode within the recessed portion.
10. The method of claim 8 , wherein the testing comprises applying electricity to the electrical connections.
11. The method of claim 8 , wherein the reflector cup first side has alignment structure having first and second surfaces formed therein, the alignment structure configured to receive the substrate within the alignment structure such that the first surface approximating the substrate surface and the second surface approximating the at least one side surface of the substrate, and wherein the connecting a reflector cup to the substrate surface comprises locating the substrate within the alignment structure.
12. The method of claim 11 , wherein the locating causes the substrate to be in a predetermined fixed position relative to the reflector cup.
13. The method of claim 8 , wherein the reflector cup is one of a plurality of reflector cups fabricated together.