DYNAMIC THERMAL MANAGEMENT SYSTEM AND METHOD
A dynamic thermal management system regulates heat dissipation of a system or device including a power supply and an amplifier. The heat dissipation from the power supply and amplifier are regulated to distribute heat more evenly across a heat sink shared by the amplifier and the power supply.
1 . A thermal management system, comprising:
a power supply;
an amplifier connected to the power supply;
an output device connected to the amplifier; and
a monitoring circuit for managing a heat output of the power supply and the amplifier,
wherein the monitoring circuit determines an output heat level of each of the power supply and amplifier and balances a heat output of the amplifier with respect to the power supply.
2 . The thermal management system according to claim 1 , wherein the audio device is a speaker.
3 . The thermal management system according to claim 1 , wherein the amplifier is a fixed rail class amplifier.
4 . The thermal management system according to claim 1 , wherein the power supply comprises a battery.
5 . The thermal management system according to claim 1 , further comprising a pulse width modulation circuit connected between the monitoring circuit and the power supply,
wherein the monitoring circuit monitors an input signal to the amplifier, and
the monitoring circuit causes the pulse width modulation circuit to reduce a duty cycle of a modulated signal to the power supply when the input signal is below a predetermined level.
6 . The method according to claim 5 , wherein the predetermined level is an input level that corresponds to one third of full output power.
7 . The thermal management system according to claim 5 , wherein the monitoring circuit causes the pulse width modulation circuit to reduce the duty cycle of the modulated signal to a level between approximately 40% and 50% of a full duty cycle.
8 . The thermal management system according to claim 1 , further comprising a pulse width modulation circuit connected between the monitoring circuit and the power supply,
wherein the monitoring circuit causes the pulse width modulation circuit to reduce a duty cycle of a modulated signal to the power supply when a heat level of at least one of the power supply and the amplifier reaches a predetermined level.
9 . The thermal management system according to claim 8 , wherein the monitoring circuit causes the pulse width modulation circuit to reduce the duty cycle of the modulated signal to 50%.
10 . The thermal management system according to claim 8 , further comprising a heat sink for sinking heat from the power supply and the amplifier, wherein the monitoring circuit monitors the heat level of the heat sink to determine whether to reduce the duty cycle of the modulated signal to the power supply.
11 . The thermal management system according to claim 10 , further comprising a sensor, wherein the monitoring circuit monitors the heat level of the heat sink via the sensor.
12 . A device for supplying signals to an audio device, comprising:
a power supply;
an amplifier connected to the power supply and such audio device; and
a monitoring circuit for managing a heat output of the power supply and the amplifier,
wherein the monitoring circuit determines an output heat level of each of the power supply and amplifier and balances a heat output of the amplifier with respect to the power supply.
13 . The device according to claim 12 , wherein the amplifier is a fixed rail class amplifier.
14 . The thermal management system according to claim 12 , wherein the power supply comprises a battery.
15 . The device according to claim 12 , further comprising a pulse width modulation circuit connected between the monitoring circuit and the power supply,
wherein the monitoring circuit monitors an input signal to the amplifier, and
the monitoring circuit causes the pulse width modulation circuit to reduce a duty cycle of a modulated signal from the pulse width modulation circuit to the power supply when the input signal is below a predetermined level.
16 . The device according to claim 15 , wherein the monitoring circuit causes the pulse width modulation circuit to reduce the duty cycle of the modulated signal to between approximately 40% and approximately 50%.
17 . The device according to claim 12 , further comprising a pulse width modulation circuit connected between the monitoring circuit and the power supply,
wherein the monitoring circuit causes the pulse width modulation circuit to reduce a duty cycle of a modulated signal to the power supply when a heat level of at least one of the power supply and the amplifier reaches a predetermined level.
18 . The device according to claim 17 , wherein the monitoring circuit causes the pulse width modulation circuit to reduce the duty cycle of the modulated signal to 50%.
19 . The device according to claim 17 , further comprising a heat sink for sinking heat from the power supply and the amplifier,
wherein the monitoring circuit monitors the heat level of the heat sink to determine whether to reduce the duty cycle of the modulated signal to the power supply.
20 . The device according to claim 19 , wherein the monitoring circuit causes the pulse width modulation circuit to reduce the duty cycle of the modulated signal to 50%.
21 . The device according to claim 19 , further comprising a sensor,
wherein the monitoring circuit monitors the heat level of the heat sink via the sensor.
22 . A method for managing a heat output of a power management device for supplying signals to an output device, the method comprising:
monitoring an input signal to an amplifier,
determining whether an input signal level is below a predetermined level,
reducing a duty cycle of a modulated signal from a pulse width modulator to the power supply when the input signal level is below a predetermined level,
monitoring a heat level of at least one of the amplifier and power supply, and
balancing a heat output of the amplifier with respect to the power supply.
23 . The method according to claim 22 , wherein the predetermined level is an input level that corresponds to one third of full output power.
24 . The method according to claim 22 , wherein the duty cycle is reduced to a level between approximately 40% and approximately 50%.
25 . A method according to claim 22 , further comprising:
reducing the duty cycle of the modulated signal when the heat level of the amplifier or the power supply exceeds a predetermined level.
26 . The method according to claim 25 , wherein the power management device comprises a monitoring circuit and a heat sink,
wherein the heat sink sinks heat from the power supply and the amplifier, and
the monitoring circuit monitors the heat level of the power supply and the amplifier by monitoring a heat level of the heat sink.
27 . The method according to claim 26 , wherein the power management device comprises a pulse width modulation circuit connected between the monitoring circuit and the power supply,
wherein the monitoring circuit causes the pulse width modulation circuit to reduce the duty cycle of the modulated signal to the power supply.