IP Library Granted Patent US 8,076,006
Granted Patent B2
US 8,076,006 · App. 12/360,655 · Granted Dec 13, 2011

Triglyceride compositions useful for preparing composite panels and applications thereof

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Quick Facts
Patent No.
US 8,076,006
App. No.
12/360,655
Granted
Dec 13, 2011
Kind
B2
Abstract

Composite panels may be prepared using a moisture resistance additive having a formulation that includes a triglyceride having a saponification value of at least 150 and an iodine value of at least 35. The additive may be used in the form of a water emulsion. The water emulsion may be prepared by dispersing the components of the additive formulation under conditions sufficient to at least partially saponify the triglyceride. The moisture resistance additive can impart resistance to moisture absorption and thickness swelling to composite panels prepared therewith.

Claims (36)

1. A composite panel prepared using a moisture resistance additive useful for preparing composite panels, the composite panel comprising:

gypsum, cellulose, or combinations thereof; and

the moisture resistance additive, wherein the moisture resistance additive was provided as an emulsion comprising:

from 10 to 50 weight percent of a triglyceride having a saponification value of at least 150 and an iodine value of at least 35;

from 0.5 to 20 weight percent of a hydrocarbon wax;

from 0.5 to 3 weight percent of a linear C 12 to C 22 fatty acid; and

a compound or compounds selected from the group consisting of an amine, an inorganic base, and mixtures thereof, wherein the amine, when present, comprises from 0.5 to 3 weight percent of the emulsion, and wherein the inorganic base, when present comprises from 0.5 to 6 weight percent of the emulsion, and

water; and wherein the emulsion is prepared under conditions sufficient to disperse components of the formulation and at least partially saponify the triglyceride.

2. The composite panel of claim 1 wherein the composite panel is a paper box, an oriented strand board, plywood, a gypsum board, or a medium density particle board.

3. The composite panel of claim 1 wherein the cellulose is selected from the group consisting of wood fiber, wood flakes, wood strands, wood chips, wood particles, recycled wood, recycled paper fiber, and mixtures thereof.

4. A method for preparing composite panels comprising introducing a moisture resistance additive useful for preparing composite panels into a composite panel, the moisture resistance additive comprising:

from 10 to 50 weight percent of a triglyceride having a saponification value of at least 150 and an iodine value of at least 35;

from 0.5 to 20 weight percent of a hydrocarbon wax;

from 0.5 to 3 weight percent of a linear C 12 to C 22 fatty acid;

a compound or compounds selected from the group consisting of an amine, an inorganic base, and mixtures thereof, wherein the amine, when present, comprises from 0.5 to 3 weight percent of the emulsion, and wherein the inorganic base, when present, comprises from 0.5 to 6 weight percent of the emulsion; and

water; and wherein the emulsion is prepared under conditions sufficient to disperse components of the formulation and at least partially saponify the triglyceride.

5. The method of claim 4 wherein the moisture resistance additive is a water emulsion.

6. The method of claim 5 wherein the moisture resistance additive is introduced into the composite panel by applying the moisture resistance additive to a cellulose component used to make the composite panel.

7. A moisture resistance additive useful for preparing composite panels comprising a triglyceride having a saponification value of at least 150 and an iodine value of at least 35, wherein the moisture resistance additive is in the form of an emulsion and comprises:

from 10 to 50 weight percent of the triglyceride having the saponification value of at least 150 and the iodine value of at least 35;

from 0.5 to 20 weight percent of a hydrocarbon wax;

from 0.5 to 3 weight percent of a linear C 12 to C 22 fatty acid;

a compound or compounds selected from the group consisting of an amine, an inorganic base, and mixtures thereof, wherein the amine, when present, comprises from 0.5 to 3 weight percent of the emulsion, and wherein the inorganic base, when present, comprises from 0.5 to 6 weight percent of the emulsion; and

water.

8. The moisture resistance additive of claim 7 wherein the emulsion is prepared using a homogenizer.

9. The moisture resistance additive of claim 7 wherein the emulsion is heated to a temperature sufficient to at least partially saponify the triglyceride.

10. The moisture resistance additive of claim 7 wherein the temperature sufficient to at least partially saponify the triglyceride is from about 110° F. to about 200° F.

11. The moisture resistance additive of claim 7 additionally comprising a component selected from the group consisting of surfactants, odorants, biocides, stabilizers, and mixtures thereof.

12. A moisture resistance additive comprising an emulsion, wherein the emulsion is prepared using a formulation comprising:

from 10 to 50 weight percent of a triglyceride having a saponification value of at least 150 and an iodine value of at least 35;

from 0.5 to 20 weight percent of a hydrocarbon wax;

from 0.5 to 3 weight percent of a linear C 12 to C 22 fatty acid; and

a compound or compounds selected from the group consisting of an amine, an inorganic base, and mixtures thereof, wherein the amine, when present, comprises from 0.5 to 3 weight percent of the emulsion, and wherein the inorganic base, when present, comprises from 0.5 to 6 weight percent of the emulsion; and

water, and wherein the emulsion is prepared under conditions sufficient to disperse components of the formulation and at least partially saponify the triglyceride.

13. The moisture resistance additive of claim 12 wherein the formulation additionally comprises a component selected from the group consisting of surfactants, odorants, biocides, stabilizers, and mixtures thereof.

14. The moisture resistance additive of claim 12 wherein the emulsion is dispersed using a homogenizer.

Assignments (19)
SECURITY INTEREST Recorded Mar 18, 2022
From: HEXION INC.; HEXION INVESTMENTS INC.
To: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
Reel/Frame 059436/0823 →
RELEASE OF SECURITY INTEREST IN PATENTS (ABL) RECORDED AT REEL/FRAME 049740/0770 Recorded Mar 18, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: HEXION INC.
Reel/Frame 059435/0490 →
SECURITY INTEREST Recorded Mar 18, 2022
From: HEXION INC.; HEXION INVESTMENTS INC.
To: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
Reel/Frame 059436/0748 →
SECURITY INTEREST Recorded Mar 18, 2022
From: HEXION INC.; HEXION INVESTMENTS INC.
To: ROYAL BANK OF CANADA, AS ADMINISTRATIVE AGENT
Reel/Frame 059436/0842 →
RELEASE OF SECURITY INTEREST IN PATENTS (TERM LOAN) RECORDED AT REEL/FRAME 049741/0425 Recorded Mar 18, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: HEXION INC.
Reel/Frame 059435/0473 →
PATENT SECURITY INTEREST (TERM LOAN) Recorded Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049741/0425 →
PATENT SECURITY INTEREST (ABL) Recorded Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049740/0770 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (030146/0970) Recorded Jul 9, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: HEXION INC. (FORMERLY KNOWN AS MOMENTIVE SPECIALTY CHEMICALS INC.)
Reel/Frame 049706/0264 →
PATENT SECURITY INTEREST ASSIGNMENT AGREEMENT Recorded Apr 3, 2019
From: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS THE PRIOR COLLATERAL AGENT
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS THE CURRENT COLLATERAL AGENT
Reel/Frame 048788/0617 →
RELEASE OF SECURITY INTEREST Recorded Feb 23, 2017
From: WILMINGTON TRUST, NATIONAL ASSOCIATION (SUCCESSOR BY MERGER TO WILMINGTON TRUST FSB), AS COLLATERAL AGENT
To: HEXION INC. (FORMERLY KNOWN AS HEXION SPECIALTY CHEMICALS INC.); BORDEN CHEMICAL FOUNDRY, LLC; HEXION INVESTMENTS INC. (FORMERLY KNOWN AS BORDEN CHEMICAL INVESTMENTS, INC.); HEXION U.S. FINANCE CORP.; HSC CAPITAL CORPORATION; LAWTER INTERNATIONAL INC.; HEXION INTERNATIONAL INC. (FORMERLY KNOWN AS BORDEN CHEMICAL INTERNATIONAL INC.); OILFIELD TECHNOLOGY GROUP, INC.; HEXION CI HOLDING COMPANY (CHINA) LLC
Reel/Frame 041793/0001 →
SECURITY INTEREST Recorded Feb 13, 2017
From: HEXION INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 041693/0888 →
CHANGE OF NAME Recorded Feb 3, 2015
From: MOMENTIVE SPECIALTY CHEMICALS INC.
To: HEXION INC.
Reel/Frame 034882/0127 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE SPECIALTY CHEMICALS INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 030146/0946 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE SPECIALTY CHEMICALS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 030146/0970 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Mar 28, 2013
From: JPMORGAN CHASE BANK, N.A.
To: MOMENTIVE SPECIALTY CHEMICALS INC. (F/K/A HEXION SPECIALTY CHEMICALS, INC.)
Reel/Frame 030111/0021 →
CHANGE OF NAME Recorded Apr 15, 2011
From: HEXION SPECIALTY CHEMICALS, INC.
To: MOMENTIVE SPECIALTY CHEMICALS INC.
Reel/Frame 026138/0817 →
SECURITY AGREEMENT Recorded Feb 5, 2010
From: HEXION LLC; HEXION SPECIALTY CHEMICALS, INC.; BORDEN CHEMICAL FOUNDRY, LLC; BORDEN CHEMICAL INVESTMENTS, INC.; HEXION U.S. FINANCE CORP.; HSC CAPITAL CORPORATION; LAWTER INTERNATIONAL INC.; BORDEN CHEMICAL INTERNATIONAL, INC.; OILFIELD TECHNOLOGY GROUP, INC.; HEXION CI HOLDING COMPANY (CHINA) LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 023905/0451 →
SECURITY INTEREST Recorded Jan 29, 2010
From: HEXION SPECIALTY CHEMICALS, INC.; BORDEN CHEMICAL FOUNDRY, LLC; BORDEN CHEMICAL INVESTMENTS, INC.; HEXION U.S. FINANCE CORP.; HSC CAPITAL CORPORATION; LAWTER INTERNATIONAL INC.; BORDEN CHEMICAL INTERNATIONAL, INC.; OILFIELD TECHNOLOGY GROUP, INC.; HEXION CI HOLDING COMPANY (CHINA) LLC
To: WILMINGTON TRUST FSB, AS COLLATERAL AGENT
Reel/Frame 023963/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2009
From: WANTLING, STEVEN J.
To: HEXION SPECIALTY CHEMICALS, INC.
Reel/Frame 022164/0612 →