Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
View Patent ↗The present invention aims to provide a semiconductor light emitting device that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same. In order to achieve the above object, the semiconductor light emitting device according to the present invention includes a luminous layer, a light transmission layer disposed over a main surface of the luminous layer, and having depressions on a surface facing away from the luminous layer, and a transmission membrane disposed on the light transmission layer so as to follow contours of the depressions, and light from the luminous layer is irradiated so as to pass through the light transmission layer and the transmission membrane.
1. A light-emitting module to be attached to a luminaire, comprising:
a substrate that is substantially round and plate-like, having a hole penetrating through to a reverse side, that is positioned, when attaching the substrate to the luminaire, so that a first main face of the substrate is in contact with the luminaire; and
a semiconductor light-emitting element that is mounted on a second main surface of the substrate, wherein
a pin is provided to extend from the surface of the luminaire that is in contact with the substrate, in a thickness direction of the substrate, and
when attaching to the luminaire, the hole in the substrate functions as a guide for the pin, and receives an insertion of the pin.
2. The light-emitting module of claim 1 , wherein
a notch is formed on a portion of an outer edge of the substrate,
on the luminaire, a depression that accommodates the substrate is formed, and a protrusion corresponding to the notch is provided to extend from a side wall of the depression, and
when attaching to the luminaire, the notch in the substrate functions as a guide for the pin, and receives an insertion of the pin.
3. The light-emitting module of claim 2 , wherein
a module terminal is formed on the second main face of the substrate so as to be in contact with the semiconductor light-emitting element on the outer edge portion, and
a feed terminal extends toward a radial inner side, and is connected to the module terminal.
4. The light-emitting module of claim 1 , wherein
the substrate includes a metal layer exposed on the first main surface.
5. A luminaire into which a light-emitting module is attached, comprising:
a luminaire body including a depression that includes a round opening, and including a pin provided to extend from a bottom face of the depression; and
a feed terminal that extends from a side wall of the depression toward a radial inner side of the depression, wherein
the light-emitting module includes a substrate that is substantially round and plate-like,
when the light-emitting module is being attached, a first main surface of the substrate is in contact with the bottom face of the depression, and a hole is provided in the substrate that penetrates through to a reverse side, and
when the light-emitting module is being attached, the hole in the substrate functions as a guide for the pin, and the pin is inserted in the hole.
6. The luminaire of claim 5 , wherein
on the side wall of the depression, a protrusion is provided to extend toward the radial inner side of the depression,
a notch is formed on a portion of an outer edge of the substrate of the light-emitting module, and
when the light-emitting module is being attached, the notch in the substrate functions as a guide for the protrusion, and the protrusion is inserted into the notch.
7. The luminaire of claim 5 , wherein
the feed terminal is cranked in the extending portion, and is connected to a module terminal formed in a second main face of the substrate in the light-emitting module.