SUBSTRATE TREATMENT APPARATUS, AND SUBSTRATE SUPPORT TO BE USED FOR THE APPARATUS
The substrate treatment apparatus according to the present invention includes a substrate holding mechanism including a support member which supports a substrate, and an extension surface which laterally surrounds one major surface of the substrate supported by the support member and extends continuously to the major surface of the substrate, a rotation mechanism which rotates the substrate holding mechanism, and an etching liquid supply mechanism which supplies an etching liquid onto the major surface of the substrate held by the substrate holding mechanism.
1 . A substrate treatment apparatus comprising:
a substrate holding mechanism including a support member which supports a substrate, and an extension surface which laterally surrounds one major surface of the substrate supported by the support member and extends continuously to the major surface of the substrate;
a rotation mechanism which rotates the substrate holding mechanism; and
an etching liquid supply mechanism which supplies an etching liquid onto the major surface of the substrate held by the substrate holding mechanism.
2 . A substrate treatment apparatus as set forth in claim 1 ,
wherein the substrate holding mechanism includes a substrate support, and a base member which supports the substrate support,
wherein the substrate support includes the support member and the extension surface,
wherein the rotation mechanism includes a base member rotating mechanism which rotates the base member together with the substrate support.
3 . A substrate treatment apparatus as set forth in claim 1 ,
wherein the substrate holding mechanism includes a base member which includes the support member and the extension surface,
wherein the rotation mechanism includes a base member rotating mechanism which rotates the base member.
4 . A substrate treatment apparatus as set forth in claim 1 , wherein the extension surface has higher affinity for the etching liquid than the major surface of the substrate supported by the support member.
5 . A substrate treatment apparatus as set forth in claim 1 ,
wherein the support member horizontally supports the substrate,
wherein the support member is configured such that the major surface of the substrate supported by the support member is located at a higher level than the extension surface.
6 . A substrate treatment apparatus as set forth in claim 5 ,
wherein the support member is configured such that, even after the substrate supported by the support member is treated with the etching liquid, the major surface of the substrate is located at a higher level than the extension surface.
7 . A substrate treatment apparatus as set forth in claim 1 ,
wherein the support member horizontally supports the substrate,
wherein the substrate holding mechanism further includes a taper surface extending continuously from the extension surface radially outward of the substrate and having a height that progressively decreases in a direction extending radially outward of the substrate.
8 . A substrate treatment apparatus as set forth in claim 1 ,
wherein the etching liquid supply mechanism scans over the entire major surface of the substrate rotated by the rotation mechanism to supply the etching liquid to the major surface of the substrate.
9 . A substrate treatment apparatus as set forth in claim 8 ,
wherein the etching liquid supply mechanism scans to a position radially outward of the peripheral portion of the substrate rotated by the rotation mechanism over the major surface of the substrate.
10 . A substrate support for supporting a substrate for use in a substrate treatment apparatus which treats the substrate with an etching liquid, the substrate support comprising:
a support member which supports the substrate; and
an extension surface which laterally surrounds one major surface of the substrate supported by the support member and extends continuously to the major surface of the substrate.