Film arrangement
View Patent ↗The present invention relates to a film arrangement featuring a layer A and a layer B, layer A and layer B being of polymer-based formation, and layers A and B being unstretched. It is proposed that layer A and layer B have different tension sets from one another, that layer A has a tension set of at least 60% and that layer B has a tension set of not more than 50%.
1. A planar film arrangement, having horizontal and longitudinal dimensions, comprising polyolefin layers A, B and C and further comprising at least one pressure-sensitive adhesive layer,
layer A having a specific flexural modulus E s which is at least 20 times that of layer B,
Layer B being in direct contact with layer A and layer C being in direct contact with layer B,
Layer A having a thickness that is at least 1.5 times the thickness of layer C,
layer A and layer B being initially unstretched, wherein
said layers A and B have different tension sets from one another,
said layer A has a tension set of at least 60% and
said layer B has a tension set of not more than 50%
said layer C having a tension set of at least 60%
wherein said arrangement, upon a longitudinal extension of at least 100% and subsequent relaxation, forms a structured surface and undergoes three-dimensional deformation to
form one or two hollow cylinders slit in the longitudinal direction.
2. The film arrangement according to claim 1 wherein layer A has a tension set of at least 70%, and/or layer B has a tension set of not more than 40%.
3. The film arrangement according to claim 1 , wherein the thickness of layer B is at least three times the thickness of layer A.
4. The film arrangement according to claim 1 , wherein the force at 10% extension is not more than 10 N/cm.
5. The film arrangement according to claim 1 , wherein the thickness of the film arrangement is 20 μm to 150 μm.
6. The film arrangement according to claim 1 , wherein layer A comprises a raw material having a flexural modulus of at least 1300 MPa, and contains said raw material at not less than 50% by weight.
7. The film arrangement according to claim 1 , wherein layer B comprises a raw material having a flexural modulus of not more than 1000 MPa , and contains said raw material at not less than 50% by weight.
8. The film arrangement according to claim 1 , wherein said arrangement is produced by coextrusion.
9. The film arrangement according to claim 1 , wherein at least one of the layers is foamed.
10. The film arrangement according to claim 1 , wherein at least one of the layers comprises a filler or a hydrocarbon resin.