IP Library Granted Patent US 8,190,110
Granted Patent B2
US 8,190,110 · App. 12/363,978 · Granted May 29, 2012

Power amplifier comprising a slotted power combiner

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Quick Facts
Patent No.
US 8,190,110
App. No.
12/363,978
Granted
May 29, 2012
Kind
B2
Abstract

According to one embodiment, a power combiner configured to receive at least two input signals and combine the input signals to generate an output signal. The power combiner may include at least two input layers and an output layer located between the input layers. Each layer may be in the shape of a slotted loop.

Claims (37)

1. A system comprising:

a power combiner configured to:

receive at least two input signals; and

combine the input signals to generate an output signal;

the power combiner comprising a plurality of layers, the plurality of layers comprising:

at least two input layers each configured to receive at least one input signal and an output layer configured to output the output signal, the output layer located between the input layers; and

each layer of the plurality of layers comprising a slotted loop, wherein:

the slotted loop of the input layers further comprises a break on one or more sides, the input layers configured to receive the input signals proximate to the break: and

the slotted loop of the output layer further comprises a break on the side of the slotted loop opposite the side that outputs the output signal.

2. The system of claim 1 , the input signals further comprising single-ended signals, the input layers configured to receive the input signals proximate to one side of the break.

3. The system of claim 1 , the input signals further comprising differential signals, each differential signal comprising a first signal and a second signal, the input layers configured to receive the first signals proximate to one side of the break and the second signals proximate to the other side of the break.

4. The system of claim 1 , further comprising at least one amplifier that provides one or more input signals to the power combiner.

5. The system of claim 4 , wherein the amplifier comprises Doherty amplifiers.

6. The system of claim 4 , further comprising at least one layer configured to receive the input signal from multiple amplifiers.

7. The system of claim 1 , the plurality of layers coupled by stacking, the stacking configured to generate a capacitive power transfer.

8. The system of claim 1 , the plurality of layers comprising a conductive material.

9. The system of claim 8 , the conductive material selected from the group of conductive materials comprising copper, aluminum, silver, and/or gold.

10. The system of claim 1 , the plurality of layers separated by an insulating material.

11. The system of claim 10 , the insulating material selected from the group of insulating materials comprising silicon dioxide, silicon, gallium arsenide, and/or germanium.

12. A method comprising:

receiving at least two input signals at a power combiner; and

combining the input signals to generate an output signal;

the power combiner comprising a plurality of layers, the plurality of layers comprising:

at least two input layers each configured to receive at least one input signal and an output layer configured to output the output signal, the output layer located between the input layers; and

each layer of the plurality of layers comprising a slotted loop, wherein:

the slotted loop of the input layers further comprises a break on one or more sides, the input layers configured to receive the input signals proximate to the break; and

the slotted loop of the output layer further comprises a break on the side of the slotted loop opposite the side that outputs the output signal.

13. The method of claim 12 , the input signals further comprising single-ended signals, the input layers configured to receive the input signals proximate to one side of the break.

14. The method of claim 12 , the input signals further comprising differential signals, each differential signal comprising a first signal and a second signal, the input layers configured to receive the first signals proximate to one side of the break and the second signals proximate to the other side of the break.

15. The method of claim 12 , further comprising at least one amplifier that provides one or more input signals to the power combiner.

16. The method of claim 15 , wherein the amplifier comprises Doherty amplifiers.

17. The method of claim 15 , further comprising at least one layer configured to receive the input signal from multiple amplifiers.

18. The method of claim 12 , the plurality of layers coupled by stacking, the stacking configured to generate a capacitive power transfer.

19. The method of claim 12 , the plurality of layers comprising a conductive material.

20. The method of claim 19 , the conductive material selected from the group of conductive materials comprising copper, aluminum, silver, and/or gold.

21. The method of claim 12 , the plurality of layers separated by an insulating material.

22. The method of claim 21 , the insulating material selected from the group of insulating materials comprising silicon dioxide, silicon, gallium arsenide, and/or germanium.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0637 →
CHANGE OF NAME Recorded Jul 6, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024630/0955 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2009
From: LAI, CHEE HONG
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022189/0055 →