Semiconductor device and manufacturing method therefor
View Patent ↗A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.
1. A manufacturing method for a semiconductor device, comprising the steps of:
applying a first adhesive surrounding a light-receiving area on each of semiconductor chips built in a semiconductor wafer;
disposing a spacer, in which at least a first projection having a predetermined height is on a surface which is on a side of the semiconductor wafer, on the first adhesive with the first projection abutting on the semiconductor wafer;
bonding a transparent substrate to the spacer via a second adhesive on an upper surface of the spacer, the transparent substrate above the light-receiving area on the semiconductor chip, by which a body of linked semiconductor devices is formed; and
dividing the body of linked semiconductor devices into pieces.
2. The manufacturing method for a semiconductor device according to claim 1 , wherein the transparent substrate is bonded with the transparent substrate abutting a second projection having a predetermined height and on a surface of the spacer which is on a side opposite to the side of the semiconductor wafer.
3. A semiconductor device comprising:
a semiconductor chip with a light-receiving area;
a spacer bonded to the semiconductor chip via a first adhesive and surrounding the light-receiving area; and
a transparent substrate bonded to the spacer via a second adhesive on an upper surface of the spacer, the transparent substrate above the light-receiving area,
wherein,
a first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and
the first projection abuts the semiconductor chip.
4. The semiconductor device according to claim 3 , wherein a second projection having a predetermined height is formed on a surface of the spacer which is on a side of the transparent substrate.
5. The semiconductor device according to claim 3 , wherein a contact area between the spacer and the semiconductor chip is increased on a periphery of a logic circuit formed on the semiconductor chip.
6. The semiconductor device according to claim 3 , wherein the spacer is made of a black material.
7. The semiconductor device according to claim 3 , wherein the spacer is made of a resin having a thermal conductivity of 1 W/mK or higher.