IP Library Granted Patent US 7,902,895
Granted Patent B2
US 7,902,895 · App. 12/365,503 · Granted Mar 8, 2011

Semiconductor device equipped with a pull-down circuit

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Quick Facts
Patent No.
US 7,902,895
App. No.
12/365,503
Granted
Mar 8, 2011
Kind
B2
Abstract

Provided is a semiconductor device equipped with a pull-down circuit capable of reducing its area. The pull-down circuit is formed of a depletion type NMOS transistor in which a gate thereof is connected to a ground potential, and an enhancement type NMOS transistor in which a gate and a drain thereof are connected to a source of the depletion type NMOS transistor and a source thereof is connected to the ground potential. An overdrive voltage of the depletion type NMOS transistor is reduced by a threshold voltage of the enhancement type NMOS transistor, whereby a size of the depletion type NMOS transistor can be reduced. Accordingly, an area of the pull-down circuit can be reduced.

Claims (38)

1. A semiconductor device comprising:

an internal node; and

a pull-down circuit connected to the internal node for fixing the internal node to low when a power signal is activated or a power supply voltage decreases, the pull-down circuit comprising:

an input terminal connected to the internal node;

a depletion type NMOS transistor connected to the input terminal; and

an enhancement type NMOS transistor comprising a gate and a drain connected to a source of the depletion type NMOS transistor, where an absolute value of a threshold voltage of the depletion type NMOS transistor is greater than an absolute value of a threshold voltage of the enhancement type NMOS transistor.

2. The semiconductor device of claim 1 , the depletion type NMOS transistor comprising:

a drain connected to the input terminal; and

a gate connected to a ground terminal.

3. The semiconductor device of claim 1 , the enhancement type NMOS transistor comprising a source connected to a ground terminal.

4. The semiconductor device of claim 1 , where the depletion type NMOS transistor is configured to have a greater driving performance than the enhancement type NMOS transistor.

5. The semiconductor device of claim 1 , the depletion type NMOS transistor comprising a width of approximately 5 μm and a length of approximately 1 μm.

6. The semiconductor device of claim 1 , the enhancement type NMOS transistor comprising a width of approximately 2 μm and a length of approximately 50 μm.

7. A semiconductor device comprising:

an internal node; and

a pull-down circuit connected to the internal node for fixing the internal node to low when a power signal is activated or a power supply voltage decreases, the pull-down circuit comprising:

a depletion type NMOS transistor comprising:

a drain connected to an internal node of the semiconductor device;

a gate connected to a ground terminal; and

a source; and

an enhancement type NMOS transistor comprising:

a gate and a drain connected to the source of the depletion type NMOS transistor; and

a source connected to the ground terminal.

8. The semiconductor device of claim 7 , where an absolute value of a threshold voltage of the depletion type NMOS transistor is greater than an absolute value of a threshold voltage of the enhancement type NMOS transistor.

9. The semiconductor device of claim 7 , the depletion type NMOS transistor comprising a width of approximately 5 μm and a length of approximately 1 μm.

10. The semiconductor device of claim 7 , the enhancement type NMOS transistor comprising a width of approximately 2 μm and a length of approximately 50 μm.

11. A semiconductor device comprising:

an internal node; and

a pull-down circuit connected to the internal node for fixing the internal node to low when a power signal is activated or a power supply voltage decreases, the pull-down circuit comprising:

a depletion type NMOS transistor connected to an internal node of the semiconductor device; and

an enhancement type NMOS transistor comprising a gate and a drain connected to a source of the depletion type NMOS transistor.

12. The semiconductor device of claim 11 , the depletion type NMOS transistor comprising:

a drain connected to the internal node; and

a gate connected to a ground terminal.

13. The semiconductor device of claim 11 , the enhancement type NMOS transistor comprising a source connected to a ground terminal.

14. The semiconductor device of claim 11 , where the depletion type NMOS transistor is configured to have a greater driving performance than the enhancement type NMOS transistor.

15. The semiconductor device of claim 11 , the depletion type NMOS transistor comprising a width of approximately 5 μm and a length of approximately 1 μm.

16. The semiconductor device of claim 11 , the enhancement type NMOS transistor comprising a width of approximately 2 μm and a length of approximately 50 μm.

Assignments (5)
CHANGE OF ADDRESS Recorded Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →
CHANGE OF NAME Recorded Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 037783 FRAME: 0166. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 23, 2016
From: SEIKO INSTRUMENTS INC
To: SII SEMICONDUCTOR CORPORATION
Reel/Frame 037903/0928 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: SEIKO INSTRUMENTS INC
To: SII SEMICONDUCTOR CORPORATION .
Reel/Frame 037783/0166 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2009
From: UTSUNOMIYA, FUMIYASU
To: SEIKO INSTRUMENTS INC.
Reel/Frame 022497/0132 →